Tomi Laurila
Tomi Laurila
Vahvistettu sähköpostiosoite verkkotunnuksessa - Kotisivu
Interfacial reactions between lead-free solders and common base materials
T Laurila, V Vuorinen, JK Kivilahti
Materials Science and Engineering: R: Reports 49 (1-2), 1-60, 2005
Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
T Laurila, V Vuorinen, M Paulasto-Kröckel
Materials Science and Engineering: R: Reports 68 (1-2), 1-38, 2010
Reactive sputter deposition and properties of TaxN thin films
T Riekkinen, J Molarius, T Laurila, A Nurmela, I Suni, JK Kivilahti
Microelectronic Engineering 64 (1-4), 289-297, 2002
Thermodynamics, diffusion and the Kirkendall effect in solids
A Paul, T Laurila, V Vuorinen, SV Divinski
Springer International Publishing, 2014
Failure mechanism of Ta diffusion barrier between Cu and Si
T Laurila, K Zeng, JK Kivilahti, J Molarius, I Suni
Journal of Applied Physics 88 (6), 3377-3384, 2000
Cycle aging of commercial NMC/graphite pouch cells at different temperatures
K Jalkanen, J Karppinen, L Skogström, T Laurila, M Nisula, K Vuorilehto
Applied Energy 154, 160-172, 2015
Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn–Cu intermetallic compound layers
T Laurila, J Hurtig, V Vuorinen, JK Kivilahti
Microelectronics Reliability 49 (3), 242-247, 2009
Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests
T Laurila, T Mattila, V Vuorinen, J Karppinen, J Li, M Sippola, JK Kivilahti
Microelectronics Reliability 47 (7), 1135-1144, 2007
Solid-state reactions between Cu (Ni) alloys and Sn
V Vuorinen, T Laurila, T Mattila, E Heikinheimo, JK Kivilahti
Journal of Electronic Materials 36 (10), 1355-1362, 2007
Chemical stability of Ta diffusion barrier between Cu and Si
T Laurila, K Zeng, JK Kivilahti, J Molarius, I Suni
Thin Solid Films 373 (1-2), 64-67, 2000
Piezoelectric coefficients and spontaneous polarization of ScAlN
MA Caro, S Zhang, T Riekkinen, M Ylilammi, MA Moram, ...
Journal of Physics: Condensed Matter 27 (24), 245901, 2015
Formation of Intermetallic Compounds Between Liquid Sn and Various CuNix Metallizations
V Vuorinen, H Yu, T Laurila, JK Kivilahti
Journal of Electronic Materials 37 (6), 792-805, 2008
Tantalum carbide and nitride diffusion barriers for Cu metallisation
T Laurila, K Zeng, JK Kivilahti, J Molarius, T Riekkinen, I Suni
Microelectronic Engineering 60 (1-2), 71-80, 2002
Phase formation between lead-free solder and finishes
V Vuorinen, T Laurila, H Yu, JK Kivilahti
Journal of Applied Physics 99 (2), 023530, 2006
Reactive phase formation in thin film metal/metal and metal/silicon diffusion couples
T Laurila, J Molarius
Critical Reviews in solid state and materials sciences 28 (3), 185-230, 2003
TaC as a diffusion barrier between Si and Cu
T Laurila, K Zeng, JK Kivilahti, J Molarius, I Suni
Journal of applied physics 91 (8), 5391-5399, 2002
New electrochemically improved tetrahedral amorphous carbon films for biological applications
T Laurila, V Protopopova, S Rhode, S Sainio, T Palomäki, M Moram, ...
Diamond and Related Materials 49, 62-71, 2014
Analysis of the redeposition of AuSn4 on Ni/Au contact pads when using SnPbAg, SnAg, and SnAgCu solders
T Laurila, V Vuorinen, T Mattila, JK Kivilahti
Journal of electronic materials 34 (1), 103-111, 2005
Hybrid carbon based nanomaterials for electrochemical detection of biomolecules
T Laurila, S Sainio, MA Caro
Progress in Materials Science 88, 499-594, 2017
Reliability of lead-free solder interconnections in thermal and power cycling tests
J Li, J Karppinen, T Laurila, JK Kivilahti
IEEE Transactions on Components and Packaging Technologies 32 (2), 302-308, 2009
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Artikkelit 1–20