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Maarten Cauwe
Maarten Cauwe
imec/UGent - Cmst
Verified email at imec.be
Title
Cited by
Cited by
Year
Flexible and stretchable electronics for wearable health devices
J Van Den Brand, M de Kok, M Koetse, M Cauwe, R Verplancke, ...
Solid-State Electronics 113, 116-120, 2015
1452015
Dual-band (28, 38) GHz coupled quarter-mode substrate-integrated waveguide antenna array for next-generation wireless systems
T Deckmyn, M Cauwe, DV Ginste, H Rogier, S Agneessens
IEEE Transactions on Antennas and Propagation 67 (4), 2405-2412, 2019
1002019
A novel 60 GHz wideband coupled half-mode/quarter-mode substrate integrated waveguide antenna
T Deckmyn, S Agneessens, ACF Reniers, AB Smolders, M Cauwe, ...
IEEE Transactions on Antennas and Propagation 65 (12), 6915-6926, 2017
762017
Broadband material parameter characterization for practical high-speed interconnects on printed circuit board
M Cauwe, J De Baets
IEEE transactions on advanced packaging 31 (3), 649-656, 2008
532008
Cost-effective high-performance air-filled SIW antenna array for the global 5G 26 GHz and 28 GHz bands
IL de Paula, S Lemey, D Bosman, Q Van den Brande, O Caytan, ...
IEEE Antennas and Wireless Propagation Letters 20 (2), 194-198, 2020
482020
Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending
DA Van Den Ende, HJ Van De Wiel, RHL Kusters, A Sridhar, JFM Schram, ...
Microelectronics Reliability 54 (12), 2860-2870, 2014
462014
Industrial and technical aspects of chip embedding technology
A Ostmann, D Manessis, J Stahr, M Beesley, M Cauwe, J De Baets
2008 2nd Electronics System-Integration Technology Conference, 315-320, 2008
372008
Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimide
L Wang, T Sterken, M Cauwe, D Cuypers, J Vanfleteren
IEEE Transactions on Components, Packaging and Manufacturing technology 2 (7 …, 2012
362012
Ultra-Long-Term Reliable Encapsulation Using an Atomic Layer Deposited HfO2/Al2O3/HfO2 Triple-Interlayer for Biomedical Implants
C Li, M Cauwe, Y Yang, D Schaubroeck, L Mader, M Op de Beeck
Coatings 9 (9), 579, 2019
242019
Novel interconnect methodologies for ultra-thin chips on foils
A Sridhar, M Cauwe, H Fledderus, RHL Kusters, J van den Brand
2012 IEEE 62nd Electronic Components and Technology Conference, 238-244, 2012
242012
Polyimide-ald-polyimide layers as hermetic encapsulant for implants
D Schaubroeck, R Verplancke, M Cauwe, D Cuypers, K Baumans, ...
XXXI international conference on surface modification technologies (SMT31), 1-6, 2017
212017
Technology development for a low-cost, roll-to-roll chip embedding solution based on PET foils
M Cauwe, B Vandecasteele, A Gielen, J De Baets, J van den Brand, ...
18th European Microelectronics & Packaging Conference, 1-6, 2011
202011
Ultra-thin biocompatible implantable chip for bidirectional communication with peripheral nerves
MO de Beeck, R Verplancke, D Schaubroeck, D Cuypers, M Cauwe, ...
2017 IEEE Biomedical Circuits and Systems Conference (BioCAS), 1-4, 2017
192017
Flexible and stretchable electronics for wearable healthcare
J van den Brand, M de Kok, A Sridhar, M Cauwe, R Verplancke, F Bossuyt, ...
2014 44th European Solid State Device Research Conference (ESSDERC), 206-209, 2014
192014
Development of an active high-density transverse intrafascicular micro-electrode probe
R Verplancke, M Cauwe, D Schaubroeck, D Cuypers, B Vandecasteele, ...
Journal of Micromechanics and Microengineering 30 (1), 015010, 2019
182019
Sensitivity analysis of broadband on-wafer dielectric spectroscopy of yeast cell suspensions up to 110 GHz
S Liu, I Ocket, M Cauwe, D Schreurs, B Nauwelaers
IEEE Microwave and Wireless Components Letters 25 (3), 199-201, 2015
182015
A conformable active matrix LED display
A Tripathi, E Smits, JL Van Der Steen, M Cauwe, R Verplancke, K Myny, ...
International meeting on information displays, 2015
182015
Large area flexible lighting foils using distributed bare LED dies on polyester substrates
DA Van den Ende, RHL Kusters, M Cauwe, A Van Der Waal, ...
Microelectronics Reliability 53 (12), 1907-1915, 2013
172013
High-yield fabrication process for 3D-stacked ultrathin chip packages using photo-definable polyimide and symmetry in packages
S Priyabadini, T Sterken, M Cauwe, L Van Hoorebeke, J Vanfleteren
IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (1 …, 2013
172013
Flipchip bonding of thin Si dies onto PET foils: possibilities and applications
J van den Brand, R Kusters, M Cauwe, D van den Ende, M Erinc
18th European Microelectronics & Packaging Conference, 1-6, 2011
172011
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