| The role of Zn precipitates and Cl− anions in pitting corrosion of Sn–Zn solder alloys JC Liu, SW Park, S Nagao, M Nogi, H Koga, JS Ma, G Zhang, ... Corrosion Science 92, 263-271, 2015 | 144 | 2015 |
| Enhanced ductility and oxidation resistance of Zn through the addition of minor elements for use in wide-gap semiconductor die-bonding materials SW Park, T Sugahara, KS Kim, K Suganuma Journal of alloys and compounds 542, 236-240, 2012 | 34 | 2012 |
| Retarding intermetallic compounds growth of Zn high-temperature solder and Cu substrate by trace element addition SW Park, S Nagao, T Sugahara, KS Kim, K Suganuma Journal of Materials Science: Materials in Electronics 24, 4704-4712, 2013 | 26 | 2013 |
| Low-pressure sintering bonding with Cu and CuO flake paste for power devices SW Park, R Uwataki, S Nagao, T Sugahara, Y Katoh, H Ishino, K Sugiura, ... 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1179-1182, 2014 | 15 | 2014 |
| Quasi-transient liquid-phase bonding by eutectic reaction of Sn-plated Zn on Cu substrate for high-temperature die attachment SW Park, S Nagao, Y Kato, H Ishino, K Sugiura, K Tsuruta, K Suganuma Journal of Alloys and Compounds 637, 143-148, 2015 | 12 | 2015 |
| High-temperature die attachment using Sn-plated Zn solder for power electronics S Park, S Nagao, Y Kato, H Ishino, K Sugiura, K Tsuruta, K Suganuma IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (7 …, 2015 | 12 | 2015 |
| Nano-SiC added Ag paste sintering die-attach for SiC power devices H Zhang, S Nagao, S Park, S Koga, T Sugahara, K Suganuma Proceedings of the 5th Electronics System-integration Technology Conference …, 2014 | 5 | 2014 |
| High-strength Si wafer bonding by self-regulated eutectic reaction with pure Zn SW Park, T Sugahara, S Nagao, K Suganuma Scripta Materialia 68 (8), 591-594, 2013 | 4 | 2013 |
| Pressure-less plasma sintering of Cu paste for SiC die-attach of high-temperature power device manufacturing S Nagao, K Kodani, S Sakamoto, SW Park, T Sugahara, K Suganuma 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1077-1079, 2014 | 3 | 2014 |
| Partial transient liquid phase bonding for high-temperature power electronics using Sn/Zn/Sn sandwich structure solder SW Park, S Nagao, T Sugahara, Y Katoh, H Ishino, K Sugiura, ... CIPS 2014; 8th International Conference on Integrated Power Electronics …, 2014 | | 2014 |
| Oxidation resistance and joining properties of Cr-doped Zn bonding for SiC die-attachment SW Park, T Sugahara, S Nagao, K Suganuma 2013 IEEE 63rd Electronic Components and Technology Conference, 1734-1739, 2013 | | 2013 |
| SiC die-attachment with minor elements added pure Zn under formic acid reflow SW Park, JL Jo, T Sugahara, M Ueshima, H Iwamoto, K Suganuma 2012 4th Electronic System-Integration Technology Conference, 1-3, 2012 | | 2012 |
Shijo NagaoAOR Ltd., JapanVahvistettu sähköpostiosoite verkkotunnuksessa aorja.com
