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Co-authors
Xiaoou TangThe Chinese University of Hong KongVerified email at ie.cuhk.edu.hk- Jiapeng ZhuThe Hong Kong University of Science and TechnologyVerified email at connect.ust.hk
- Edward Y ChangStanford UniversityVerified email at cs.stanford.edu
- Zhouchen LinProfessor, Peking University; Fellow of IEEE, IAPR & CSIG; ex-VP of Samsung ResearchVerified email at pku.edu.cn
- Bolei ZhouAssistant Professor at UCLAVerified email at ucla.edu
- Zhiyuan LiuAssociate Professor, Tsinghua UniversityVerified email at tsinghua.edu.cn
- Cheng YangBeijing University of Posts and TelecommunicationsVerified email at mails.tsinghua.edu.cn
- Maosong SunProfessor of Computer Science and Technology, Tsinghua UniversityVerified email at tsinghua.edu.cn
- Tianhao ZhangGeneral ElectricVerified email at uphs.upenn.edu
- Xiaogang WangProfessor of Electronic Engineering, the Chinese University of Hong KongVerified email at ee.cuhk.edu.hk
- Wayne ZhangThe Chinese University of Hong KongVerified email at ie.cuhk.edu.hk
- Qifeng ChenHKUSTVerified email at ust.hk
- Wenbing HuangGSAI, Renmin University of ChinaVerified email at ruc.edu.cn
- Rong XiaoMicrosoft RedmondVerified email at microsoft.com
- Yuanjun XiongAmazon Web ServicesVerified email at amazon.com
- Wei Liu, Fellow of IEEE/IAPR/IMADistinguished Scientist, TencentVerified email at ee.columbia.edu
- Chuang GanUMass Amherst | MIT-IBM Watson AI LabVerified email at csail.mit.edu
- Yi YangZhejiang UniversityVerified email at zju.edu.cn
- Chaochao LuShanghai AI LaboratoryVerified email at pjlab.org.cn
- Huaping Liu（刘华平）Department of Computer Science and Technology, Tsinghua UniversityVerified email at tsinghua.edu.cn
