| Experimental realization of an epsilon-near-zero metamaterial at visible wavelengths R Maas, J Parsons, N Engheta, A Polman Nature Photonics 7 (11), 907-912, 2013 | 555 | 2013 |
| High-NA EUV lithography exposure tool: advantages and program progress J Van Schoot, S Lok, E van Setten, R Maas, K Troost, R Peeters, J Finders, ... Extreme Ultraviolet Lithography 2020 11517, 76-89, 2021 | 38 | 2021 |
| Negative refractive index and higher-order harmonics in layered metallodielectric optical metamaterials R Maas, E Verhagen, J Parsons, A Polman Acs Photonics 1 (8), 670-676, 2014 | 30 | 2014 |
| Stochastics in extreme ultraviolet lithography: investigating the role of microscopic resist properties for metal-oxide-based resists R Maas, MC van Lare, G Rispens, SF Wuister Journal of Micro/Nanolithography, MEMS, and MOEMS 17 (4), 041003-041003, 2018 | 23 | 2018 |
| Planar metal/dielectric single-periodic multilayer ultraviolet flat lens R Maas, J van de Groep, A Polman Optica 3 (6), 592-596, 2016 | 19 | 2016 |
| Experimental realization of a polarization-independent ultraviolet/visible coaxial plasmonic metamaterial MA Van de Haar, R Maas, H Schokker, A Polman Nano letters 14 (11), 6356-6360, 2014 | 18 | 2014 |
| High-NA EUVL exposure tool: key advantages and program status J Van Schoot, S Lok, E van Setten, R Maas, R Peeters, J Finders, ... International Conference on Extreme Ultraviolet Lithography 2021 11854, 1185403, 2021 | 12 | 2021 |
| Generalized antireflection coatings for complex bulk metamaterials R Maas, SA Mann, DL Sounas, A Alu, EC Garnett, A Polman Physical Review B 93 (19), 195433, 2016 | 10 | 2016 |
| Analyze line roughness sources using power spectral density (PSD) L Pu, T Wang, TJ Huisman, R Maas, M Goosen, H Dillen, P Leray, W Fang Metrology, Inspection, and Process Control for Microlithography XXXIII 10959 …, 2019 | 8 | 2019 |
| Surface plasmon polariton modes in coaxial metal-dielectric-metal waveguides MA Van de Haar, R Maas, B Brenny, A Polman New Journal of Physics 18 (4), 043016, 2016 | 5 | 2016 |
| Method for determining defectiveness of pattern based on after development image M Kooiman, M Pisarenco, A Slachter, MJ Maslow, BAO RIVERA, WT Tel, ... US Patent App. 17/640,792, 2022 | 2 | 2022 |
| Evaluation of resist performance for 22nm half-pitch and beyond using EUV interference lithography A Langner, Y Ekinci, R Gronheid, S Wang, E van Setten, ... International Symposium on Extreme Ultraviolet Lithography 1, 2010 | 2 | 2010 |
| Predictive compact model for stress-induced on-product overlay correction H Zhang, C Tabery, R Maas, O Khodko, VM Blanco Carballo, E Canga, ... Journal of Micro/Nanopatterning, Materials, and Metrology 21 (4), 043201-043201, 2022 | 1 | 2022 |
| Particle beam apparatus, defect repair method, lithographic exposure process and lithographic system RC Maas, AO Polyakov, TJ Coenen US Patent App. 17/271,667, 2021 | 1 | 2021 |
| Holistic assessment and control of total CDU J Finders, V Vaenkatesan, L van Kessel, R Maas, T van Rhee, V Kakkar, ... Optical and EUV Nanolithography XXXVII 12953, 15-27, 2024 | | 2024 |
| Method of metrology and associated apparatuses TJ Huisman, RC Maas, HA Dillen US Patent 11,733,614, 2023 | | 2023 |
| Method of metrology and associated apparatuses TJ Huisman, RC Maas, HA Dillen US Patent 11,112,703, 2021 | | 2021 |
| Photomask J van Schoot, S Lok, E van Setten, R Maas, K Troost, R Peeters, J Finders, ... | | 2021 |
| Method and apparatus for forming a patterned layer of material PWH De Jager, SF Wuister, VAN Marie-Claire, RC Maas, AO Polyakov, ... US Patent App. 16/971,012, 2021 | | 2021 |
| Light propagation in multilayer metamaterials RC Maas Universiteit van Amsterdam [Host], 2015 | | 2015 |
