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Brian R. Burg
Brian R. Burg
Wyss Zurich, ETH Zurich
Verified email at ethz.ch - Homepage
Title
Cited by
Cited by
Year
An electrical method for the measurement of the thermal and electrical conductivity of reduced graphene oxide nanostructures
T Schwamb, BR Burg, NC Schirmer, D Poulikakos
Nanotechnology 20 (40), 405704, 2009
1752009
An integrated perfusion machine preserves injured human livers for 1 week
D Eshmuminov, D Becker, L Bautista Borrego, M Hefti, MJ Schuler, ...
Nature biotechnology 38 (2), 189-198, 2020
1272020
A microfluidic approach for the formation of conductive nanowires and hollow hybrid structures
J Puigmartí‐Luis, D Schaffhauser, BR Burg, PS Dittrich
Advanced Materials 22 (20), 2255-2259, 2010
922010
Co‐synthesis of H2 and ZnO by in‐situ Zn aerosol formation and hydrolysis
FO Ernst, A Tricoli, SE Pratsinis, A Steinfeld
AIChE journal 52 (9), 3297-3303, 2006
832006
Electrokinetic framework of dielectrophoretic deposition devices
BR Burg, V Bianco, J Schneider, D Poulikakos
Journal of Applied Physics 107 (12), 124308, 2010
672010
Piezoresistive pressure sensors with parallel integration of individual single-walled carbon nanotubes
BR Burg, T Helbling, C Hierold, D Poulikakos
Journal of Applied Physics 109 (6), 064310, 2011
512011
High-yield dielectrophoretic assembly of two-dimensional graphene nanostructures
BR Burg, F Lütolf, J Schneider, NC Schirmer, T Schwamb, D Poulikakos
Applied Physics Letters 94 (5), 053110, 2009
452009
On the effect of the electrical contact resistance in nanodevices
T Schwamb, BR Burg, NC Schirmer, D Poulikakos
Applied Physics Letters 92 (24), 243106, 2008
412008
Aqueous dispersion and dielectrophoretic assembly of individual surface-synthesized single-walled carbon nanotubes
BR Burg, J Schneider, M Muoth, L Durrer, T Helbling, NC Schirmer, ...
Langmuir 25 (14), 7778-7782, 2009
392009
A dielectrophoretic method for high yield deposition of suspended, individual carbon nanotubes with four-point electrode contact
T Schwamb, TY Choi, N Schirmer, NR Bieri, B Burg, J Tharian, ...
Nano Letters 7 (12), 3633-3638, 2007
36*2007
Large-scale integration of single-walled carbon nanotubes and graphene into sensors and devices using dielectrophoresis: A review
BR Burg, D Poulikakos
Journal of Materials Research 26 (13), 1561-1571, 2011
322011
On ejecting colloids against capillarity from sub‐micrometer openings: on‐demand dielectrophoretic nanoprinting
NC Schirmer, C Kullmann, MS Schmid, BR Burg, T Schwamb, ...
Advanced Materials 22 (42), 4701-4705, 2010
322010
Dielectrophoretic integration of single-and few-layer graphenes
BR Burg, J Schneider, S Maurer, NC Schirmer, D Poulikakos
Journal of Applied Physics 107 (3), 034302, 2010
302010
Effects of radiative forcing of building integrated photovoltaic systems in different urban climates
BR Burg, P Ruch, S Paredes, B Michel
Solar Energy 147, 399-405, 2017
262017
Selective parallel integration of individual metallic single-walled carbon nanotubes from heterogeneous solutions
BR Burg, J Schneider, V Bianco, NC Schirmer, D Poulikakos
Langmuir 26 (13), 10419-10424, 2010
242010
Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
T Brunschwiler, J Zürcher, L Del Carro, G Schlottig, BR Burg, ...
Journal of Electronic Packaging 138 (4), 041009, 2016
21*2016
Steady-state low thermal resistance characterization apparatus: The bulk thermal tester
BR Burg, M Kolly, N Blasakis, D Gschwend, J Zürcher, T Brunschwiler
Review of Scientific Instruments 86 (12), 124903, 2015
172015
Placement and efficiency effects on radiative forcing of solar installations
BR Burg, P Ruch, S Paredes, B Michel
AIP Conference Proceedings 1679, 090001, 2015
132015
Millimeter-wave on-chip solenoid inductor by on-demand three-dimensional printing of colloidal nanoparticles
NC Schirmer, J Hesselbarth, S Strohle, BR Burg, MK Tiwari, D Poulikakos
Applied Physics Letters 97 (24), 243109, 2010
122010
Enhanced percolating thermal underfills achieved by means of nanoparticle bridging necks
J Zürcher, X Chen, BR Burg, S Zimmermann, R Straessle, AR Studart, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 6 …, 2016
112016
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Articles 1–20