Matti Mantysalo
Matti Mantysalo
Tampere University
Verified email at tuni.fi
Title
Cited by
Cited by
Year
A health-IoT platform based on the integration of intelligent packaging, unobtrusive bio-sensor, and intelligent medicine box
G Yang, L Xie, M Mäntysalo, X Zhou, Z Pang, L Da Xu, S Kao-Walter, ...
IEEE transactions on industrial informatics 10 (4), 2180-2191, 2014
5532014
Handbook of silicon based MEMS materials and technologies
M Tilli, M Paulasto-Kröckel, M Petzold, H Theuss, T Motooka, V Lindroos
Elsevier, 2020
4332020
Inkjet-printed graphene/PEDOT: PSS temperature sensors on a skin-conformable polyurethane substrate
T Vuorinen, J Niittynen, T Kankkunen, TM Kraft, M Mäntysalo
Scientific reports 6 (1), 1-8, 2016
1622016
Alternative sintering methods compared to conventional thermal sintering for inkjet printed silver nanoparticle ink
J Niittynen, R Abbel, M Mäntysalo, J Perelaer, US Schubert, D Lupo
Thin Solid Films 556, 452-459, 2014
1492014
Comparison of laser and intense pulsed light sintering (IPL) for inkjet-printed copper nanoparticle layers
J Niittynen, E Sowade, H Kang, RR Baumann, M Mäntysalo
Scientific reports 5 (1), 1-10, 2015
1362015
Screen-printing fabrication and characterization of stretchable electronics
J Suikkola, T Björninen, M Mosallaei, T Kankkunen, P Iso-Ketola, ...
Scientific reports 6 (1), 1-8, 2016
1252016
Low temperature nanoparticle sintering with continuous wave and pulse lasers
T Kumpulainen, J Pekkanen, J Valkama, J Laakso, R Tuokko, ...
Optics & Laser Technology 43 (3), 570-576, 2011
1022011
System design issues for 3D system-in-package (SiP)
J Miettinen, M Mantysalo, K Kaija, EO Ristolainen
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004
982004
An inkjet-deposited antenna for 2.4 GHz applications
M Mäntysalo, P Mansikkamäki
AEU-International Journal of Electronics and Communications 63 (1), 31-35, 2009
912009
Inkjet printed system-in-package design and manufacturing
J Miettinen, V Pekkanen, K Kaija, P Mansikkamäki, J Mäntysalo, ...
Microelectronics Journal 39 (12), 1740-1750, 2008
882008
Bio-patch design and implementation based on a low-power system-on-chip and paper-based inkjet printing technology
G Yang, L Xie, M Mäntysalo, J Chen, H Tenhunen, LR Zheng
IEEE transactions on information technology in biomedicine 16 (6), 1043-1050, 2012
682012
Evaluation of inkjet technology for electronic packaging and system integration
M Mantysalo, P Mansikkamaki, J Miettinen, K Kaija, S Pienimaa, ...
2007 Proceedings 57th Electronic Components and Technology Conference, 89-94, 2007
662007
Body-worn antennas making a splash: Lifejacket-integrated antennas for global search and rescue satellite system
J Lilja, V Pynttäri, T Kaija, R Mäkinen, E Halonen, H Sillanpää, ...
IEEE Antennas and Propagation Magazine 55 (2), 324-341, 2013
632013
Oven sintering process optimization for inkjet-printed Ag nanoparticle ink
E Halonen, T Viiru, K Ostman, AL Cabezas, M Mantysalo
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (2 …, 2012
592012
Utilizing inkjet printing to fabricate electrical interconnections in a system-in-package
V Pekkanen, M Mäntysalo, K Kaija, P Mansikkamäki, E Kunnari, K Laine, ...
Microelectronic Engineering 87 (11), 2382-2390, 2010
492010
Capability of inkjet technology in electronics manufacturing
M Mantysalo, V Pekkanen, K Kaija, J Niittynen, S Koskinen, E Halonen, ...
2009 59th Electronic Components and Technology Conference, 1330-1336, 2009
442009
Electrical performance and reliability evaluation of inkjet-printed Ag interconnections on paper substrates
L Xie, M Mäntysalo, AL Cabezas, Y Feng, F Jonsson, LR Zheng
Materials Letters 88, 68-72, 2012
432012
Screen-printed curvature sensors for soft robots
A Koivikko, ES Raei, M Mosallaei, M Mäntysalo, V Sariola
IEEE Sensors Journal 18 (1), 223-230, 2017
422017
Inkjet-deposited interconnections for electronic packaging
M Mäntysalo, P Mansikkamäki
NIP & Digital Fabrication Conference 2007 (2), 813-817, 2007
422007
Electrical performance characterization of an inkjet-printed flexible circuit in a mobile application
S Koskinen, L Pykäri, M Mäntysalo
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (9 …, 2013
392013
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