| Diamond-like carbon (DLC) thin film bioelectrodes: Effect of thermal post-treatments and the use of Ti adhesion layer T Laurila, A Rautiainen, S Sintonen, H Jiang, E Kaivosoja, J Koskinen Materials Science and Engineering: C 34, 446-454, 2014 | 44 | 2014 |
| Microstructural characterization and mechanical performance of wafer-level SLID bonded Au-Sn and Cu-Sn seal rings for MEMS encapsulation A Rautiainen, H Xu, E Österlund, J Li, V Vuorinen, M Paulasto-Kröckel Journal of Electronic Materials 44, 4533-4548, 2015 | 39 | 2015 |
| Wafer-level AuSn/Pt solid–liquid interdiffusion bonding A Rautiainen, V Vuorinen, H Heikkinen, M Paulasto-Kröckel IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (2 …, 2018 | 15 | 2018 |
| Improving the function of dopamine electrodes with novel carbon materials E Kaivosoja, E Berg, A Rautiainen, T Palomäki, J Koskinen, ... 2013 35th Annual International Conference of the IEEE Engineering in …, 2013 | 14 | 2013 |
| Optimization of contact metallizations for reliable wafer level AuSn bonds V Vuorinen, A Rautiainen, H Heikkinen, M Paulasto-Kröckel Microelectronics Reliability 64, 676-680, 2016 | 12 | 2016 |
| Reliability performance of Au-Sn and Cu-Sn wafer level SLID bonds for MEMS H Xu, A Rautiainen, V Vuorinen, E Österlund, T Suni, H Heikkinen, ... Proceedings of the 5th Electronics System-integration Technology Conference …, 2014 | 9 | 2014 |
| Vertical cracking of Cu-Sn solid-liquid interdiffusion bond under thermal shock test A Rautiainen, V Vuorinen, J Li, M Paulasto-Kröckel Materials Today: Proceedings 4 (7), 7093-7100, 2017 | 7 | 2017 |
| The effect of platinum contact metallization on Cu/Sn bonding A Rautiainen, G Ross, V Vuorinen, H Dong, M Paulasto-Kröckel Journal of Materials Science: Materials in Electronics 29, 15212-15222, 2018 | 6 | 2018 |
| Mechanical characterization of SLID bonded Au-Sn and Cu-Sn interconnections for MEMS packaging A Rautiainen, E Österlund, H Xu, V Vuorinen, M Paulasto-Kröckel Proc. 5th Electron. Mater., Process., Packag. Space (EMPPS) Workshop, 1-7, 2014 | 6 | 2014 |
| Interfacial Reactions Between ZnAl (Ge) Solders on Cu and Ni Substrates A Rautiainen, V Vuorinen, M Paulasto-Kröckel Journal of Electronic Materials 46, 2323-2333, 2017 | 2 | 2017 |
| Electric Commercial Vehicles (ECV) NO Nylund, M Säynätjoki, M Korkiakoski, M Antikainen, M Koskue, ... VTT Technical Research Centre of Finland, 2019 | 1 | 2019 |
| Solid-liquid interdiffusion bonding for MEMS device integration A Rautiainen Aalto University, 2018 | 1 | 2018 |
| Developing the load monitoring of Helsinki Energy's 110 kV network A Rautiainen | 1 | 2002 |
| Design for reliability of Au-Sn and Cu-Sn based SLID bonds V Vuorinen, A Rautiainen, M Paulasto-Kröckel 2015 European Microelectronics Packaging Conference (EMPC), 1-6, 2015 | | 2015 |
| Timantinkaltaisen hiilen adheesio bioelektrodille A Rautiainen | | 2013 |
| Printattavan elektroniikan valmistustekniikoita A Rautiainen | | 2009 |
| ESO valuation under IFRS 2-considerations of agency theory, risk aversion and the binomial model A Pirjetä, A Rautiainen Helsinki: Helsinki School of Economics, 2005 | | 2005 |
| Rautiainen, Antti; Ross, Glenn; Vuorinen, Vesa; Dong, Hongqun; Paulasto-Kröckel, Mervi The effect of platinum contact metallization on Cu/Sn bonding A Rautiainen | | |
| Tässä tutkimuksessa analysoidaan ja verra-taan rahastonhoitajien ja tilintarkastajien eettisiä arvoja. Tutkimuskyselyyn saatiin 75 vas-tausta (vastausprosentti oli 33, 5% ja … M MALKAMÄKI, A RAUTIAINEN | | |
| Advanced Packaging Technologies A Rautiainen, V Vuorinen, H Heikkinen, M Paulasto-Kröckel | | |
