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John A. RogersSimpson/Querrey Professor, Northwestern UniversityVerified email at northwestern.edu
Roozbeh GhaffariNorthwestern University, Center for Bio-Integrated ElectronicsVerified email at northwestern.edu
Jungil ChoiDept. of Mechanical Engineering, Ajou UniversityVerified email at ajou.ac.kr
Tomoyuki YokotaUniversity of TokyoVerified email at ntech.t.u-tokyo.ac.jp
Walter VoitUniversity of Texas at DallasVerified email at utdallas.edu
Tsuyoshi Sekitani, Ph.D, ProfessorThe Institute of Scientific and Industrial Research,Osaka UniversityVerified email at sanken.osaka-u.ac.jp
Takao SomeyaProfessor, Department of Electric and Electronic Engineering, The University of TokyoVerified email at ee.t.u-tokyo.ac.jp
Amay Jairaj BandodkarAssistant Professor at North Carolina State UniversityVerified email at ncsu.edu
Philipp GutrufGutrufLab, Assoc. Prof. BME,2024 da Vinci Fellow, University of ArizonaVerified email at email.arizona.edu
Siddharth KrishnanResearch Scientist, Massachusetts Institute of Technology, Boston Children's HospitalVerified email at mit.edu
Martin KaltenbrunnerSoft Matter Physics and LIT Soft Materials Lab, Johannes Kepler University LinzVerified email at jku.at
Yonggang HuangWalter P. Murphy Professor of M.E., C.E.E. and M.S.E., Northwestern UniversityVerified email at northwestern.edu
Taylor WareAssociate Professor, Biomedical Engineering, Materials Science and Engineering, Texas A&M UniversityVerified email at tamu.edu
Yeguang XueApple Inc.Verified email at apple.com
Siegfried BauerFIEEE, Professor of Soft Matter Physics, Johannes Kepler University Linz, AustriaVerified email at jku.at
Zhigang Suo (锁志刚)Harvard Princeton UCSBVerified email at seas.harvard.edu