Johan Liu
Title
Cited by
Cited by
Year
Conductive adhesives for electronics packaging
B Ellis
Soldering & Surface Mount Technology, 2000
3132000
Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives
L Ye, Z Lai, J Liu, A Tholen
IEEE Transactions on Electronics Packaging Manufacturing 22 (4), 299-302, 1999
2201999
Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates
Z Lai, J Liu
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1996
1961996
Overview of conductive adhesive interconnection technologies for LCDs
H Kristiansen, J Liu
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1998
1881998
Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
C Andersson, Z Lai, J Liu, H Jiang, Y Yu
Materials Science and Engineering: A 394 (1-2), 20-27, 2005
1382005
Characterization of liquid crystal polymer for high frequency system-in-a-package applications
G Zou, H Gronqvist, JP Starski, J Liu
IEEE Transactions on Advanced Packaging 25 (4), 503-508, 2002
1362002
Electrospun polyurethane scaffolds for proliferation and neuronal differentiation of human embryonic stem cells
B Carlberg, MZ Axell, U Nannmark, J Liu, HG Kuhn
Biomedical Materials 4 (4), 045004, 2009
1342009
A reliable and environmentally friendly packaging technology-flip-chip joining using anisotropically conductive adhesive
J Liu, A Tolvgard, J Malmodin, Z Lai
IEEE Transactions on Components and Packaging Technologies 22 (2), 186-190, 1999
1201999
A reliable and environmentally friendly packaging technology-flip-chip joining using anisotropically conductive adhesive
J Liu, A Tolvgard, J Malmodin, Z Lai
IEEE Transactions on Components and Packaging Technologies 22 (2), 186-190, 1999
1201999
Bioactive 3D cell culture system minimizes cellular stress and maintains the in vivo‐like morphological complexity of astroglial cells
TB Puschmann, C Zandén, Y De Pablo, F Kirchhoff, M Pekna, J Liu, ...
Glia 61 (3), 432-440, 2013
1162013
Novel nanostructured thermal interface materials: a review
J Hansson, TMJ Nilsson, L Ye, J Liu
International Materials Reviews 63 (1), 22-45, 2018
1062018
Functionalization mediates heat transport in graphene nanoflakes
H Han, Y Zhang, N Wang, MK Samani, Y Ni, ZY Mijbil, M Edwards, ...
Nature communications 7 (1), 1-9, 2016
932016
Thermal chemical vapor deposition grown graphene heat spreader for thermal management of hot spots
Z Gao, Y Zhang, Y Fu, MMF Yuen, J Liu
Carbon 61, 342-348, 2013
872013
Low partial pressure chemical vapor deposition of graphene on copper
J Sun, N Lindvall, MT Cole, KTT Angel, T Wang, KBK Teo, DHC Chua, ...
IEEE transactions on nanotechnology 11 (2), 255-260, 2011
852011
Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy
Y Gao, C Zou, B Yang, Q Zhai, J Liu, E Zhuravlev, C Schick
Journal of Alloys and Compounds 484 (1-2), 777-781, 2009
832009
Carbon‐nanotube through‐silicon via interconnects for three‐dimensional integration
T Wang, K Jeppson, L Ye, J Liu
Small 7 (16), 2313-2317, 2011
812011
Improved heat spreading performance of functionalized graphene in microelectronic device application
Y Zhang, H Han, N Wang, P Zhang, Y Fu, M Murugesan, M Edwards, ...
Advanced Functional Materials 25 (28), 4430-4435, 2015
782015
ACA bonding technology for low cost electronics packaging applications-current status and remaining challenges
J Liu
4th International Conference on Adhesive Joining and Coating Technology in …, 2000
782000
Overview of conductive adhesive joining technology in electronics packaging applications
J Liu, Z Lai, H Kristiansen, C Khoo
Proceedings of 3rd International Conference on Adhesive Joining and Coating …, 1998
781998
Controllable chemical vapor deposition of large area uniform nanocrystalline graphene directly on silicon dioxide
J Sun, N Lindvall, MT Cole, T Wang, TJ Booth, P Bøggild, KBK Teo, J Liu, ...
Journal of Applied Physics 111 (4), 044103, 2012
752012
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