G. Andrew Antonelli

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Yoshio NishiElectrical Engineering, Stanford UniversityVerified email at stanford.edu
Michael T. NicholsDirector, Etch Technology, Applied MaterialsVerified email at amat.com
Harsh SinhaVerified email at wisc.edu
Brian C DalyVassar CollegeVerified email at vassar.edu
He RenApplied Materials, IncVerified email at amat.com
Nick KellerDirector of Applications, Onto InnovationVerified email at ontoinnovation.com
Sean KingPrincipal EngineerVerified email at intel.com
Nerissa DraegerLam ResearchVerified email at lamresearch.com
Qinghuang LinDirector, Technology Development Center, ASML USVerified email at asml.com
Arto NurmikkoProfessor of Engineering and Physics, Brown UniversityVerified email at brown.edu
NCM FullerIBM Research, Bell Labs and Columbia UniversityVerified email at us.ibm.com
Krishna NittalaApplied MaterialsVerified email at ufl.edu
Shan Chebrown universtiyVerified email at brown.edu
Samer BannaTechnion, Israel Institute of Technology, Applied MaterialsVerified email at amat.com
David G. CahillDepartment of Materials Science and Engineering, University of Illinois at Urbana-ChampaignVerified email at illinois.edu
R. SooryakumarProfessor of Physics, Ohio State UniversityVerified email at osu.edu
Jeffry KelberUniversity of North TexasVerified email at unt.edu
David B. GravesProfessor of Chemical and Biological Engineering, Princeton UniversityVerified email at princeton.edu
Swayambhu P Behera, PhDUniversity of North Texas, Applied MaterialsVerified email at my.unt.edu
Jengyi E. YuLam ResearchVerified email at lamresearch.com

G. Andrew Antonelli

VP of Advanced R&D, Onto Innovation, Inc.

Verified email at ontoinnovation.com

Metrology Materials Characterization Thin Film Deposition


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Smooth silicon-containing films K Fox, D Niu, J Womack, M Sriram, GA Antonelli, B Van Schravendijk, ... US Patent 8,709,551, 2014	473	2014
Remote plasma processing of interface surfaces GA Antonelli, J O'Loughlin, T Xavier, M Sriram, B van Schravendijk, ... US Patent App. 12/533,960, 2010	447	2010
PECVD flowable dielectric gap fill GA Antonelli, B Van Schravendijk US Patent 8,557,712, 2013	394	2013
Cleaning of carbon-based contaminants in metal interconnects for interconnect capping applications GA Antonelli, TJ Knisley, P Subramonium US Patent App. 14/314,479, 2015	362	2015
In-situ deposition of film stacks J Haverkamp, P Subramonium, J Womack, D Niu, K Fox, J Alexy, ... US Patent 8,741,394, 2014	318	2014
Vacuum-integrated hardmask processes and apparatus J Marks, GA Antonelli, RA Gottscho, DM Hausmann, A Lavoie, TJ Knisley, ... US Patent 9,778,561, 2017	293	2017
Low-K oxide deposition by hydrolysis and condensation NM Ndiege, K Nittala, DB Wong, GA Antonelli, NS Draeger, ... US Patent 9,245,739, 2016	271	2016
Measurement of bandgap energies in low-k organosilicates MT Nichols, W Li, D Pei, GA Antonelli, Q Lin, S Banna, Y Nishi, JL Shohet Journal of Applied Physics 115 (9), 2014	134	2014
Picosecond ultrasonics study of the vibrational modes of a nanostructure GA Antonelli, HJ Maris, SG Malhotra, JME Harper Journal of applied physics 91 (5), 3261-3267, 2002	128	2002
Characterization of mechanical and thermal properties using ultrafast optical metrology GA Antonelli, B Perrin, BC Daly, DG Cahill MRS bulletin 31 (8), 607-613, 2006	120	2006
Oxygen radical and plasma damage of low-k organosilicate glass materials: Diffusion-controlled mechanism for carbon depletion MA Goldman, DB Graves, GA Antonelli, SP Behera, JA Kelber Journal of Applied Physics 106 (1), 2009	87	2009
Selective Capping of Metal Interconnect Lines during Air Gap Formation K Chattopadhyay, GA Antonelli, P Subramonium, M Sriram, TA Spurlin US Patent App. 13/482,786, 2013	80	2013
Interfacial capping layers for interconnects J Yu, HJ Wu, G Dixit, B Van Schravendijk, P Subramonium, G Jiang, ... US Patent 8,268,722, 2012	69	2012
Interfacial layers for electromigration resistance improvement in damascene interconnects A Banerji, GA Antonelli, J O'loughlin, M Sriram, B Van Schravendijk, ... US Patent 7,648,899, 2010	61	2010
Interfacial layers for electromigration resistance improvement in damascene interconnects A Banerji, GA Antonelli, J O'loughlin, M Sriram, B Van Schravendijk, ... US Patent 7,648,899, 2010	61	2010
Interfacial layers for electromigration resistance improvement in damascene interconnects A Banerji, GA Antonelli, J O'loughlin, M Sriram, B Van Schravendijk, ... US Patent 7,648,899, 2010	61	2010
UV and reducing treatment for K recovery and surface clean in semiconductor processing B Varadarajan, GA Antonelli, B Van Schravendijk US Patent 10,037,905, 2018	60	2018
Silicon nitride films for semiconductor device applications K Fox, D Niu, JL Womack, M Sriram, GA Antonelli, BJ Van Schravendijk, ... US Patent App. 13/766,696, 2013	58	2013
Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursor NS Draeger, KA Ashtiani, D Padhi, DB Wong, BJ Van Schravendijk, ... US Patent 10,049,921, 2018	52	2018
Perspective: Optical measurement of feature dimensions and shapes by scatterometry AC Diebold, A Antonelli, N Keller Apl Materials 6 (5), 2018	50	2018

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