| Design of metal interconnects for stretchable electronic circuits M Gonzalez, F Axisa, MV Bulcke, D Brosteaux, B Vandevelde, ... Microelectronics reliability 48 (6), 825-832, 2008 | 467 | 2008 |
| Design issues and considerations for low-cost 3-D TSV IC technology G Van der Plas, P Limaye, I Loi, A Mercha, H Oprins, C Torregiani, S Thijs, ... IEEE Journal of Solid-State Circuits 46 (1), 293-307, 2010 | 388 | 2010 |
| Hermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages B Vandevelde, M Gonzalez, P Limaye, P Ratchev, E Beyne 5th International Conference on Thermal and Mechanical Simulation and …, 2004 | 167 | 2004 |
| Stress-induced large-area lift-off of crystalline Si films F Dross, J Robbelein, B Vandevelde, E Van Kerschaver, I Gordon, ... Applied Physics A 89, 149-152, 2007 | 143 | 2007 |
| Cu pumping in TSVs: Effect of pre-CMP thermal budget I De Wolf, K Croes, OV Pedreira, R Labie, A Redolfi, M Van De Peer, ... Microelectronics Reliability 51 (9-11), 1856-1859, 2011 | 139 | 2011 |
| Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV C Okoro, K Vanstreels, R Labie, O Lühn, B Vandevelde, B Verlinden, ... Journal of Micromechanics and Microengineering 20 (4), 045032, 2010 | 118 | 2010 |
| A generic methodology for deriving compact dynamic thermal models, applied to the PSGA package F Christiaens, B Vandevelde, E Beyne, R Mertens, J Berghmans IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1998 | 101 | 1998 |
| Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu C Okoro, R Labie, K Vanstreels, A Franquet, M Gonzalez, B Vandevelde, ... Journal of Materials Science 46, 3868-3882, 2011 | 90 | 2011 |
| Design and performance of metal conductors for stretchable electronic circuits M Gonzalez, F Axisa, F Bossuyt, YY Hsu, B Vandevelde, J Vanfleteren Circuit World 35 (1), 22-29, 2009 | 87 | 2009 |
| Extraction of the appropriate material property for realistic modeling of through-silicon-vias using μ-Raman spectroscopy C Okoro, Y Yang, B Vandevelde, B Swinnen, D Vandepitte, B Verlinden, ... 2008 International Interconnect Technology Conference, 16-18, 2008 | 84 | 2008 |
| Reliability and failure analysis of Sn-Ag-Cu solder interconnections for PSGA packages on Ni/Au surface finish P Ratchev, B Vandevelde, I De Wolf IEEE Transactions on Device and Materials Reliability 4 (1), 5-10, 2004 | 75 | 2004 |
| Impact of post-plating anneal and through-silicon via dimensions on Cu pumping J De Messemaeker, OV Pedreira, B Vandevelde, H Philipsen, I De Wolf, ... 2013 IEEE 63rd electronic components and technology conference, 586-591, 2013 | 63 | 2013 |
| Mechanical FEM simulation of bonding process on Cu LowK wafers D Degryse, B Vandevelde, E Beyne IEEE transactions on components and packaging technologies 27 (4), 643-650, 2004 | 61 | 2004 |
| Thermo-mechanics of 3D-wafer level and 3D stacked IC packaging technologies B Vandevelde, C Okoro, M Gonzalez, B Swinnen, E Beyne EuroSimE 2008-International Conference on Thermal, Mechanical and Multi …, 2008 | 60 | 2008 |
| Analysis of the induced stresses in silicon during thermcompression Cu-Cu bonding of Cu-through-vias in 3D-SIC architecture C Okoro, M Gonzalez, B Vandevelde, B Swinnen, G Eneman, S Stoukatch, ... 2007 Proceedings 57th Electronic Components and Technology Conference, 249-255, 2007 | 57 | 2007 |
| Challenges for structural stability of ultra-low-k-based interconnects F Iacopi, SH Brongersma, B Vandevelde, M O'Toole, D Degryse, ... Microelectronic engineering 75 (1), 54-62, 2004 | 57 | 2004 |
| Elimination of the axial deformation problem of Cu‐TSV in 3D integration C Okoro, C Huyghebaert, J Van Olmen, R Labie, K Lambrinou, ... AIP Conference Proceedings 1300 (1), 214-220, 2010 | 52 | 2010 |
| Embedding and assembly of ultrathin chips in multilayer flex boards W Christiaens, T Löher, B Pahl, M Feil, B Vandevelde, J Vanfleteren Circuit World 34 (3), 3-8, 2008 | 48 | 2008 |
| Design and implementation of flexible and stretchable systems M Gonzalez, B Vandevelde, W Christiaens, YY Hsu, F Iker, F Bossuyt, ... Microelectronics Reliability 51 (6), 1069-1076, 2011 | 46 | 2011 |
| Parameterized modeling of thermomechanical reliability for CSP assemblies B Vandevelde, E Beyne, K Zhang, J Caers, D Vandepitte, M Baelmans J. Electron. Packag. 125 (4), 498-505, 2003 | 46 | 2003 |
