Seuraa
Stefan G Hoffmann
Stefan G Hoffmann
Hochschule Ruhr West
Vahvistettu sähköpostiosoite verkkotunnuksessa hs-ruhrwest.de
Nimike
Viittaukset
Viittaukset
Vuosi
Origin and quantification of increased core loss in MnZn ferrite plates of a multi-gap inductor
D Neumayr, D Bortis, JW Kolar, S Hoffmann, E Hoene
CPSS Transactions on Power Electronics and Applications 4 (1), 72-93, 2019
222019
Advances in automotive interior lighting concerning new LED approach and optical performance
K Blankenbach, F Hertlein, S Hoffmann
Journal of the Society for Information Display 28 (8), 655-667, 2020
162020
Modeling method of stray magnetic couplings in an EMC filter for a SiC solar inverter
T Masuzawa, E Hoene, S Hoffmann, KD Lang
2014 International Power Electronics Conference (IPEC-Hiroshima 2014-ECCE …, 2014
122014
Analysis of security features in DLMS/COSEM: Vulnerabilities and countermeasures
N Luring, D Szameitat, S Hoffmann, G Bumiller
2018 IEEE Power & Energy Society Innovative Smart Grid Technologies …, 2018
112018
Reducing inductor size in high frequency grid feeding inverters
S Hoffmann, E Hoene, O Zeiter, KD Lang, G Feix
Proceedings of PCIM Europe 2015; International Exhibition and Conference for …, 2015
112015
Double pulse vs. indirect measurement: Characterizing switching losses of integrated power modules with wide bandgap semiconductors
A Kuczmik, S Hoffmann, E Hoene
CIPS 2020; 11th International Conference on Integrated Power Electronics …, 2020
82020
Modeling method of stray magnetic couplings in an EMC filter for power electronic devices
T Masuzawa, E Hoene, S Hoffmann, KD Lang
IEEJ Journal of Industry Applications 4 (6), 738-744, 2015
82015
Integrating volunteers into rescue processes: analysis of user requirements and mobile app conception
H Detjen, S Hoffmann, L Rösner, S Winter, S Geisler, N Krämer, ...
International Journal of Information Systems for Crisis Response and …, 2015
82015
New security features in DLMS/COSEM—A comparison to the smart meter gateway
SG Hoffmann, R Massink, G Bumiller
2015 IEEE Innovative Smart Grid Technologies-Asia (ISGT ASIA), 1-6, 2015
72015
Effective method for filter design and semiconductor and inductors loss calculation
S Hoffmann, E Hoene, O Zeiter, A Kuczmik, KD Lang
2016 18th European Conference on Power Electronics and Applications (EPE'16 …, 2016
62016
Layer-2 security for PLC-a comparison between ITU-T G. 9903 and IEEE 1901.2
SG Hoffmann
2016 International Symposium on Power Line Communications and its …, 2016
62016
System Simulation of Automotive High Voltage Grids: Modelling of Power Converters and Connecting Cables
S Schoerle, E Hoene, S Hoffmann, A Kuczmik, KD Lang
2014 IEEE Vehicle Power and Propulsion Conference (VPPC), 1-6, 2014
52014
Electrical, thermal and electromagnetic design of a SiC solar inverter: a case study
S Hoffmann, E Hoene, O Zeiter
PCIM Europe 2013, 470-477, 2013
52013
A New Filter Concept for High Pulse-Frequency 3-Phase AFE Motor Drives
S Hoffmann, M Bock, E Hoene
Energies 14 (10), 2814, 2021
42021
14‐1: Invited Paper: Advances in Automotive Interior Lighting
K Blankenbach, F Hertlein, S Hoffmann
SID Symposium Digest of Technical Papers 50 (1), 176-179, 2019
42019
Ferrite embedding for Power SiPs-a packaging view
T Thomas, M Schneider-Ramelow, S Hoffmann, KF Becker, H Walter, ...
CIPS 2018; 10th International Conference on Integrated Power Electronics …, 2018
42018
Deep voxel-guided morphometry (vgm): learning regional brain changes in serial mri
AK Schnurr, P Eisele, C Rossmanith, S Hoffmann, J Gregori, ...
Machine Learning in Clinical Neuroimaging and Radiogenomics in Neuro …, 2020
32020
Feasibility of fully automated atrophy measurement of the upper cervical spinal cord for group analyses and patientindividual diagnosis support in MS
J Gregori, C Cornelissen, S Hoffmann, M Treiber, S Randoll, S Heldmann, ...
MULTIPLE SCLEROSIS JOURNAL 24, 623-624, 2018
32018
Packaging Platform for low to medium Power Packages
T Thomas, TD Nguyen, M Blechert, S Hoffmann, M Obst, KF Becker, ...
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 39-44, 2022
22022
Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging
T Thomas, M van Dijk, M Dreissigacker, S Hoffmann, H Walter, KF Becker, ...
Journal of Microelectronics and Electronic Packaging 17 (2), 35-44, 2020
22020
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