| Localized electrodeposition and patterning using bipolar electrochemistry TM Braun, DT Schwartz Journal of The Electrochemical Society 162 (4), D180, 2015 | 52 | 2015 |
| The emerging role of electrodeposition in additive manufacturing TM Braun, DT Schwartz The Electrochemical Society Interface 25 (1), 69, 2016 | 44 | 2016 |
| A high-throughput structural and electrochemical study of metallic glass formation in Ni–Ti–Al H Joress, BL DeCost, S Sarker, TM Braun, S Jilani, R Smith, L Ward, ... ACS combinatorial science 22 (7), 330-338, 2020 | 38 | 2020 |
| Effect of chloride concentration on copper deposition in through silicon vias TM Braun, D Josell, M Silva, J Kildon, TP Moffat Journal of The Electrochemical Society 166 (1), D3259, 2019 | 36 | 2019 |
| Simulation of copper electrodeposition in through-hole vias TM Braun, D Josell, J John, TP Moffat Journal of The Electrochemical Society 167 (1), 013510, 2019 | 30 | 2019 |
| Superconformal nickel deposition in through silicon vias: experiment and prediction TM Braun, SH Kim, HJ Lee, TP Moffat, D Josell Journal of the Electrochemical Society 165 (7), D291, 2018 | 29 | 2018 |
| High-Aspect-Ratio Ag Nanowire Mat Electrodes for Electrochemical CO Production from CO2 D Raciti, T Braun, BM Tackett, H Xu, M Cruz, BJ Wiley, TP Moffat ACS Catalysis 11 (19), 11945-11959, 2021 | 21 | 2021 |
| Microelectrode studies of S-NDR copper electrodeposition: potentiodynamic and galvanodynamic measurements and simulations TM Braun, D Josell, TP Moffat Journal of The Electrochemical Society 167 (8), 082509, 2020 | 16 | 2020 |
| Bipolar Electrochemical Displacement: A New Phenomenon with Implications for Self‐Limiting Materials Patterning TM Braun, DT Schwartz ChemElectroChem 3 (3), 441-449, 2016 | 14 | 2016 |
| Simulating the influence of supporting electrolyte concentration on copper electrodeposition in microvias TM Braun, J John, N Jayaraju, D Josell, TP Moffat Journal of The Electrochemical Society 169 (1), 012502, 2022 | 13 | 2022 |
| Development of an automated millifluidic platform and data-analysis pipeline for rapid electrochemical corrosion measurements: a pH study on Zn-Ni H Joress, B DeCost, N Hassan, TM Braun, JM Gorham, J Hattrick-Simpers Electrochimica Acta 428, 140866, 2022 | 10 | 2022 |
| Simulating Cu electrodeposition in high aspect ratio features: effect of control mode and uncompensated resistance in S-NDR systems TM Braun, D Josell, TP Moffat Electrochimica Acta 375, 137925, 2021 | 9 | 2021 |
| Superconformal Film Growth: From Smoothing Surfaces to Interconnect Technology TP Moffat, TM Braun, D Raciti, D Josell Accounts of Chemical Research 56 (9), 1004-1017, 2023 | 8 | 2023 |
| Simulation of copper electrodeposition in millimeter size through-silicon vias TM Braun, D Josell, S Deshpande, J John, TP Moffat Journal of The Electrochemical Society 167 (16), 162508, 2020 | 7 | 2020 |
| Remote control electrodeposition: principles for bipolar patterning of substrates without an electrical connection TM Braun, DT Schwartz Journal of The Electrochemical Society 163 (12), D3014, 2016 | 7 | 2016 |
| Mapping Surface Chemistry During Superfilling with Shell-Isolated Nanoparticle Enhanced Raman Spectroscopy and X-ray Photoelectron Spectroscopy D Raciti, T Braun, ARH Walker, TP Moffat Journal of The Electrochemical Society 169 (8), 082506, 2022 | 5 | 2022 |
| Effect of chloride on microstructure in Cu filled microscale through silicon vias SH Kim, HJ Lee, TM Braun, TP Moffat, D Josell Journal of the Electrochemical Society 168 (11), 112501, 2021 | 5 | 2021 |
| Exploring the kinetic and thermodynamic relationship of charge transfer reactions used in localized electrodeposition and patterning in a scanning bipolar cell TM Braun, DT Schwartz Frontiers in chemistry 7, 340, 2019 | 4 | 2019 |
| Bipolar electrochemical printing T Braun, DT Schwartz US Patent 9,677,186, 2017 | 4 | 2017 |
| Mechanism of bismuth stimulated bottom-up gold feature filling D Josell, TM Braun, TP Moffat Journal of the Electrochemical Society 169 (12), 122507, 2022 | 3 | 2022 |
