| Cost-Effective Design of Scalable High-Performance Systems Using Active and Passive Interposers D Stow, Y Xie, T Siddiqua, GH Loh 2017 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 728-735, 2017 | 119 | 2017 |
| Cost analysis and cost-driven IP reuse methodology for SoC design based on 2.5 D/3D integration D Stow, I Akgun, R Barnes, P Gu, Y Xie Proceedings of the 35th International Conference on Computer-Aided Design …, 2016 | 58 | 2016 |
| Leveraging 3d technologies for hardware security: Opportunities and challenges P Gu, S Li, D Stow, R Barnes, L Liu, Y Xie, E Kursun Great Lakes Symposium on VLSI (GLSVLSI), 2016 International, 347-352, 2016 | 49 | 2016 |
| Die stacking is happening X Hu, D Stow, Y Xie IEEE micro 38 (1), 22-28, 2018 | 35 | 2018 |
| Thermal-aware 3D design for side-channel information leakage P Gu, D Stow, R Barnes, E Kursun, Y Xie 2016 IEEE 34th International Conference on Computer Design (ICCD), 520-527, 2016 | 34 | 2016 |
| Security threats and countermeasures in three-dimensional integrated circuits J Dofe, P Gu, D Stow, Q Yu, E Kursun, Y Xie Proceedings of the on Great Lakes Symposium on VLSI 2017, 321-326, 2017 | 29 | 2017 |
| Cost and thermal analysis of high-performance 2.5 D and 3D integrated circuit design space D Stow, I Akgun, R Barnes, P Gu, Y Xie 2016 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), 637-642, 2016 | 21 | 2016 |
| Investigation of cost-optimal network-on-chip for passive and active interposer systems D Stow, I Akgun, Y Xie 2019 ACM/IEEE International Workshop on System Level Interconnect Prediction …, 2019 | 17 | 2019 |
| Cost-efficient 3D integration to hinder reverse engineering during and after manufacturing P Gu, D Stow, P Mukim, S Li, Y Xie 2018 Asian Hardware Oriented Security and Trust Symposium (AsianHOST), 74-79, 2018 | 12 | 2018 |
| Network-on-chip design guidelines for monolithic 3-D integration I Akgun, D Stow, Y Xie IEEE Micro 39 (6), 46-53, 2019 | 9 | 2019 |
| Efficient system architecture in the era of monolithic 3D: Dynamic inter-tier interconnect and processing-in-memory D Stow, I Akgun, W Huangfu, Y Xie, X Li, GH Loh Proceedings of the 56th Annual Design Automation Conference 2019, 1-4, 2019 | 8 | 2019 |
| Cost-effective design of scalable high-performance systems using active and passive interposers, in 2017 IEEE D Stow, Y Xie, T Siddiqua, GH Loh ACM International Conference on Computer-Aided Design (ICCAD), 728-735, 2017 | 6 | 2017 |
| Power profiling of modern die-stacked memory D Stow, A Farmahini-Farahani, S Gurumurthi, M Ignatowski, Y Xie IEEE Computer Architecture Letters 18 (2), 132-135, 2019 | 4 | 2019 |
| Yield-driven minimum energy CMOS cell design MA Korbel, DC Stow, CR Ferguson, DM Harris 2012 Conference Record of the Forty Sixth Asilomar Conference on Signals …, 2012 | 3 | 2012 |
| Cost-Driven Integration Architectures for Multi-Die Silicon Systems DS Randall University of California, Santa Barbara, 2020 | 1 | 2020 |
Yuan XieChair Professor of Hong Kong University of Science and Technology (HKUST)Vahvistettu sähköpostiosoite verkkotunnuksessa ust.hk
