Seuraa
Michael T Barako
Michael T Barako
Senior Staff Scientist, NG Next Basic Research Laboratory, Northrop Grumman Space Systems
Vahvistettu sähköpostiosoite verkkotunnuksessa NorthropGrummanNext.net - Kotisivu
Nimike
Viittaukset
Viittaukset
Vuosi
Thermal cycling, mechanical degradation, and the effective figure of merit of a thermoelectric module
MT Barako, W Park, AM Marconnet, M Asheghi, KE Goodson
Journal of electronic materials 42, 372-381, 2013
1482013
Thermal conduction in vertically aligned copper nanowire arrays and composites
MT Barako, S Roy-Panzer, TS English, T Kodama, M Asheghi, TW Kenny, ...
ACS applied materials & interfaces 7 (34), 19251-19259, 2015
1302015
Power density optimization for micro thermoelectric generators
MT Dunham, MT Barako, S LeBlanc, M Asheghi, B Chen, KE Goodson
Energy 93, 2006-2017, 2015
962015
Quasi-ballistic electronic thermal conduction in metal inverse opals
MT Barako, A Sood, C Zhang, J Wang, T Kodama, M Asheghi, X Zheng, ...
Nano letters 16 (4), 2754-2761, 2016
922016
Enhanced capillary‐fed boiling in copper inverse opals via template sintering
C Zhang, JW Palko, MT Barako, M Asheghi, JG Santiago, KE Goodson
Advanced Functional Materials 28 (41), 1803689, 2018
812018
Thermal homeostasis using microstructured phase-change materials
SH Wu, M Chen, MT Barako, V Jankovic, PWC Hon, LA Sweatlock, ...
Optica 4 (11), 1390-1396, 2017
792017
Dense Vertically Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials
MT Barako, SG Isaacson, F Lian, E Pop, RH Dauskardt, KE Goodson, ...
ACS Applied Materials & Interfaces 9 (48), 42067-42074, 2017
652017
Optimizing the design of composite phase change materials for high thermal power density
MT Barako, S Lingamneni, JS Katz, T Liu, KE Goodson, J Tice
Journal of Applied Physics 124 (14), 2018
562018
Integrated nanomaterials for extreme thermal management: A perspective for aerospace applications
MT Barako, V Gambin, J Tice
Nanotechnology 29 (15), 154003, 2018
562018
Capillary wicking in hierarchically textured copper nanowire arrays
J Lee, Y Suh, PP Dubey, MT Barako, Y Won
ACS applied materials & interfaces 11 (1), 1546-1554, 2018
542018
Microscale liquid transport in polycrystalline inverse opals across grain boundaries
QN Pham, MT Barako, J Tice, Y Won
Scientific reports 7 (1), 10465, 2017
492017
Approaching the practical conductivity limits of aerosol jet printed silver
ES Rosker, MT Barako, E Nguyen, D DiMarzio, K Kisslinger, DW Duan, ...
ACS applied materials & interfaces 12 (26), 29684-29691, 2020
442020
Experimental Demonstration of Dynamic Thermal Regulation using Vanadium Dioxide Thin Films
AM Morsy, MT Barako, V Jankovic, VD Wheeler, MW Knight, ...
Scientific Reports 10, 13964, 2020
442020
High heat flux two-phase cooling of electronics with integrated diamond/porous copper heat sinks and microfluidic coolant supply
JW Palko, H Lee, DD Agonafer, C Zhang, KW Jung, J Moss, JD Wilbur, ...
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
422016
Phonon conduction in silicon nanobeam labyrinths
W Park, G Romano, EC Ahn, T Kodama, J Park, MT Barako, J Sohn, ...
Scientific reports 7 (1), 6233, 2017
382017
Achieving high thermoelectric performance and metallic transport in solvent‐sheared PEDOT: PSS
AC Hinckley, SC Andrews, MT Dunham, A Sood, MT Barako, S Schneider, ...
Advanced Electronic Materials 7 (3), 2001190, 2021
352021
Solder-bonded carbon nanotube thermal interface materials
MT Barako, Y Gao, AM Marconnet, M Asheghi, KE Goodson
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012
342012
Effect of thermal cycling on commercial thermoelectric modules
W Park, MT Barako, AM Marconnet, M Asheghi, KE Goodson
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012
332012
Reactive metal bonding of carbon nanotube arrays for thermal interface applications
MT Barako, Y Gao, Y Won, AM Marconnet, M Asheghi, KE Goodson
IEEE Transactions on Components, Packaging and Manufacturing Technology 4 …, 2014
272014
Inverse opals for fluid delivery in electronics cooling systems
TJ Dusseault, J Gires, MT Barako, Y Won, DD Agonafer, M Asheghi, ...
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014
272014
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Artikkelit 1–20