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Pradeep Lall
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Influence of temperature on microelectronics and system reliability: A physics of failure approach
P Lall, MG Pecht, EB Hakim
CRC press, 2020
3182020
Reliability of the aging lead free solder joint
H Ma, JC Suhling, P Lall, MJ Bozack
56th Electronic Components and Technology Conference 2006, 16 pp., 2006
2292006
The influence of elevated temperature aging on reliability of lead free solder joints
H Ma, JC Suhling, Y Zhang, P Lall, MJ Bozack
2007 Proceedings 57th Electronic Components and Technology Conference, 653-668, 2007
2272007
Determination of Anand constants for SAC solders using stress-strain or creep data
M Motalab, Z Cai, JC Suhling, P Lall
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012
1982012
The effects of aging temperature on SAC solder joint material behavior and reliability
Y Zhang, Z Cai, JC Suhling, P Lall, MJ Bozack
2008 58th Electronic Components and Technology Conference, 99-112, 2008
1862008
Models for reliability prediction of fine-pitch BGAs and CSPs in shock and drop-impact
P Lall, DR Panchagade, Y Liu, RW Johnson, JC Suhling
IEEE Transactions on Components and Packaging Technologies 29 (3), 464-474, 2006
1812006
Reduction of lead free solder aging effects using doped SAC alloys
Z Cai, Y Zhang, JC Suhling, P Lall, RW Johnson, MJ Bozack
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
1742010
Model for BGA and CSP reliability in automotive underhood applications
P Lall, MN Islam, N Singh, JC Suhling, R Darveaux
IEEE Transactions on Components and Packaging Technologies 27 (3), 585-593, 2004
1722004
Solder joint reliability in electronics under shock and vibration using explicit finite-element submodeling
P Lall, S Gupte, P Choudhary, J Suhling
IEEE transactions on electronics packaging manufacturing 30 (1), 74-83, 2007
1622007
Health monitoring for damage initiation & progression during mechanical shock in electronic assemblies
P Lall, P Choudhary, S Gupte, J Suhling
56th Electronic Components and Technology Conference 2006, 10 pp., 2006
1422006
Flexible connector for circuit boards
JG Gillette, SG Potter, P Lall
US Patent 5,742,484, 1998
1401998
Failure-envelope approach to modeling shock and vibration survivability of electronic and MEMS packaging
P Lall, DR Panchagade, P Choudhary, S Gupte, JC Suhling
IEEE Transactions on Components and Packaging Technologies 31 (1), 104-113, 2008
1372008
Prognostics and health management of electronic packaging
P Lall, MN Islam, MK Rahim, JC Suhling
IEEE Transactions on Components and Packaging Technologies 29 (3), 666-677, 2006
1362006
Improved predictions of lead free solder joint reliability that include aging effects
M Motalab, Z Cai, JC Suhling, J Zhang, JL Evans, MJ Bozack, P Lall
2012 IEEE 62nd Electronic Components and Technology Conference, 513-531, 2012
1312012
The effects of aging on the cyclic stress-strain behavior and hysteresis loop evolution of lead free solders
M Mustafa, Z Cai, JC Suhling, P Lall
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 927-939, 2011
1242011
Correlation of reliability models including aging effects with thermal cycling reliability data
M Motalab, M Mustafa, JC Suhling, J Zhang, J Evans, MJ Bozack, P Lall
2013 IEEE 63rd Electronic Components and Technology Conference, 986-1004, 2013
1212013
The effects of SAC alloy composition on aging resistance and reliability
Y Zhang, Z Cai, JC Suhling, P Lall, MJ Bozack
2009 59th Electronic Components and Technology Conference, 370-389, 2009
1182009
Statistical pattern recognition and built-in reliability test for feature extraction and health monitoring of electronics under shock loads
P Lall, P Choudhary, S Gupte, J Hofmeister
IEEE Transactions on Components and Packaging Technologies 32 (3), 600-616, 2009
1162009
Characterization of aging effects in lead free solder joints using nanoindentation
M Hasnine, M Mustafa, JC Suhling, BC Prorok, MJ Bozack, P Lall
2013 IEEE 63rd Electronic Components and Technology Conference, 166-178, 2013
1102013
Effect of aging on the high strain rate mechanical properties of SAC105 and SAC305 leadfree alloys
P Lall, S Shantaram, J Suhling, D Locker
2013 IEEE 63rd Electronic Components and Technology Conference, 1277-1293, 2013
1042013
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