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Chad Huard
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Photo–roll lithography (PRL) for continuous and scalable patterning with application in flexible electronics
JG Ok, MK Kwak, CM Huard, HS Youn, LJ Guo
Advanced materials 25 (45), 6554-6561, 2013
992013
Highly stable and stretchable graphene–polymer processed silver nanowires hybrid electrodes for flexible displays
Q Zhang, Y Di, CM Huard, LJ Guo, J Wei, J Guo
Journal of Materials Chemistry C 3 (7), 1528-1536, 2015
632015
Atomic layer etching of 3D structures in silicon: Self-limiting and nonideal reactions
CM Huard, Y Zhang, S Sriraman, A Paterson, KJ Kanarik, MJ Kushner
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 35 (3 …, 2017
552017
Role of neutral transport in aspect ratio dependent plasma etching of three-dimensional features
CM Huard, Y Zhang, S Sriraman, A Paterson, MJ Kushner
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 35 (5 …, 2017
462017
ITO‐free, compact, color liquid crystal devices using integrated structural color filters and graphene electrodes
J Guo, CM Huard, Y Yang, YJ Shin, KT Lee, LJ Guo
Advanced Optical Materials 2 (5), 435-441, 2014
402014
Transient behavior in quasi-atomic layer etching of silicon dioxide and silicon nitride in fluorocarbon plasmas
CM Huard, S Sriraman, A Paterson, MJ Kushner
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 36 (6 …, 2018
382018
Abnormal Multiple Charge Memory States in Exfoliated Few-Layer WSe2 Transistors
M Chen, Y Wang, N Shepherd, C Huard, J Zhou, LJ Guo, W Lu, X Liang
ACS nano, 2017
362017
Investigation of feature orientation and consequences of ion tilting during plasma etching with a three-dimensional feature profile simulator
Y Zhang, C Huard, S Sriraman, J Belen, A Paterson, MJ Kushner
Journal of Vacuum Science & Technology A 35 (2), 021303, 2017
352017
Plasma etching of high aspect ratio features in SiO2 using Ar/C4F8/O2 mixtures: A computational investigation
S Huang, C Huard, S Shim, SK Nam, IC Song, S Lu, MJ Kushner
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 37 (3 …, 2019
342019
Consequences of atomic layer etching on wafer scale uniformity in inductively coupled plasmas
CM Huard, SJ Lanham, MJ Kushner
Journal of Physics D: Applied Physics 51 (15), 155201, 2018
132018
Electrowetting on flexible, transparent and conducting single-layer graphene
XB Tan, J Yang, P Zeng, EGR Kim, C Huard, MMC Cheng
2012 IEEE 25th International Conference on Micro Electro Mechanical Systems …, 2012
92012
Control and enhancement of graphene sensitivity by engineering edge defects
X Tan, C Huard, HJ Chuang, MW Lin, Z Zhou, MMC Cheng
SENSORS, 2012 IEEE, 1-4, 2012
62012
Nano-Scale Feature Profile Modeling of Plasma Material Processing
CM Huard
Ph. D. Thesis, 2018
12018
Contact Edge Roughness In The Etching Of High Aspect Ratio Contacts In Sio2
S Huang, C Huard, MJ Kushner, S Shim, S Lee, IC Song, S Lu
2017 IEEE International Conference on Plasma Science (ICOPS), 1-1, 2017
12017
Origins of aspect ratio dependent etching in plasma materials processing
CM Huard, MJ Kushner, Y Zhang, S Sriraman, JR Belen, A Paterson
2016 IEEE International Conference on Plasma Science (ICOPS), 1-1, 2016
12016
Trilayer hard mark lithography and etch for BEOL manufacturing
P Panneerchelvam, CM Huard, A Agarwal, AV Pret, A Mani, R Gronheid, ...
Metrology, Inspection, and Process Control XXXVI 12053, 628-634, 2022
2022
System and Method to Adjust A Kinetics Model of Surface Reactions During Plasma Processing
AA Agarwal, C Huard, Y Zhang, H Pu, X Li, P Panneerchelvam, F Han, ...
US Patent App. 16/872,879, 2021
2021
Optimizing Plasma Etching of High Aspect Ratio Oxide-Nitride-Oxide Stacks
S Huang, C Huard, SK Nam, S Shim, W Ko, MJ Kushner
APS Annual Gaseous Electronics Meeting Abstracts, NR2. 003, 2018
2018
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