Kye Yak  See
Cited by
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Electromagnetic interference shielding effectiveness of carbon-based materials prepared by screen printing
LL Wang, BK Tay, KY See, Z Sun, LK Tan, D Lua
Carbon 47 (8), 1905-1910, 2009
Measurement of noise source impedance of SMPS using a two probes approach
KY See, J Deng
IEEE transactions on Power Electronics 19 (3), 862-868, 2004
Accurate extraction of noise source impedance of an SMPS under operating conditions
V Tarateeraseth, B Hu, KY See, FG Canavero
IEEE Transactions on Power Electronics 25 (1), 111-117, 2009
Phthalonitrile-based carbon foam with high specific mechanical strength and superior electromagnetic interference shielding performance
L Zhang, M Liu, S Roy, EK Chu, KY See, X Hu
ACS applied materials & interfaces 8 (11), 7422-7430, 2016
Systematic electromagnetic interference filter design based on information from in-circuit impedance measurements
V Tarateeraseth, KY See, FG Canavero, RWY Chang
IEEE Transactions on Electromagnetic Compatibility 52 (3), 588-598, 2010
Static energy meter errors caused by conducted electromagnetic interference
F Leferink, C Keyer, A Melentjev
IEEE electromagnetic compatibility magazine 5 (4), 49-55, 2016
Ultrathin and flexible screen-printed metasurfaces for EMI shielding applications
LB Wang, KY See, JW Zhang, B Salam, ACW Lu
IEEE Transactions on Electromagnetic Compatibility 53 (3), 700-705, 2011
Mussel-inspired polydopamine coated hollow carbon microspheres, a novel versatile filler for fabrication of high performance syntactic foams
L Zhang, S Roy, Y Chen, EK Chua, KY See, X Hu, M Liu
ACS applied materials & interfaces 6 (21), 18644-18652, 2014
Comprehensive analysis of the impact of via design on high-speed signal integrity
RWY Chang, KY See, EK Chua
2007 9th Electronics Packaging Technology Conference, 262-266, 2007
LCL filter design of a 50-kW 60-kHz SiC inverter with size and thermal considerations for aerospace applications
Y Liu, KY See, S Yin, R Simanjorang, CF Tong, A Nawawi, JSJ Lai
IEEE transactions on Industrial Electronics 64 (10), 8321-8333, 2017
In-circuit characterization of common-mode chokes
J Deng, KY See
IEEE transactions on electromagnetic compatibility 49 (2), 451-454, 2007
Network for conducted EMI diagnosis
KY See
Electronics Letters 35 (17), 1446-1447, 1999
Design and demonstration of high power density inverter for aircraft applications
A Nawawi, CF Tong, S Yin, A Sakanova, Y Liu, Y Liu, M Kai, KY See, ...
IEEE Transactions on Industry Applications 53 (2), 1168-1176, 2016
Integration of dual-band monopole and microstrip grid array for single-chip tri-band application
L Zhang, KY See, B Zhang, YP Zhang
IEEE transactions on antennas and propagation 61 (1), 439-443, 2012
A practical approach to EMC education at the undergraduate level
Y Zhao, KY See
IEEE Transactions on Education 47 (4), 425-429, 2004
Effect of carbon nanofiber reinforcement on electromagnetic interference shielding effectiveness of syntactic foam
L Zhang, LB Wang, KY See, J Ma
Journal of Materials Science 48 (21), 7757-7763, 2013
Gate driver optimization to mitigate shoot-through in high-speed switching SiC half bridge module
S Yin, KJ Tseng, CF Tong, R Simanjorang, CJ Gajanayake, A Nawawi, ...
2015 IEEE 11th International Conference on Power Electronics and Drive …, 2015
Radio-frequency common-mode noise propagation model for power-line cable
KY See, PL So, A Kamarul, E Gunawan
IEEE Transactions on power Delivery 20 (4), 2443-2449, 2005
Inductive Coupled In-Circuit Impedance Monitoring of Electrical System Using Two-Port ABCD Network Approach
KR Li, KY See, XM Li
IEEE Transactions on instrumentation and measurement 64 (9), 2489-2495, 2015
Electromagnetic coupling analysis of transient signal through slots or apertures perforated in a shielding metallic enclosure using FDTD methodology
YJ Wang, WJ Koh, CK Lee, KY See
Progress In Electromagnetics Research 36, 247-264, 2002
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