RF-system-on-package (SOP) for wireless communications K Lim, S Pinel, M Davis, A Sutono, CH Lee, D Heo, A Obatoynbo, J Laskar, ...
IEEE Microwave magazine 3 (1), 88-99, 2002
252 2002 A 90nm cmos 60ghz radio S Pinel, S Sarkar, P Sen, B Perumana, D Yeh, D Dawn, J Laskar
2008 IEEE International Solid-State Circuits Conference-Digest of Technical …, 2008
216 2008 A V-band front-end with 3-D integrated cavity filters/duplexers and antenna in LTCC technologies JH Lee, N Kidera, G DeJean, S Pinel, J Laskar, MM Tentzeris
IEEE Transactions on Microwave Theory and Techniques 54 (7), 2925-2936, 2006
136 2006 Low-loss LTCC cavity filters using system-on-package technology at 60 GHz JH Lee, S Pinel, J Papapolymerou, J Laskar, MM Tentzeris
IEEE Transactions on Microwave Theory and Techniques 53 (12), 3817-3824, 2005
136 2005 3-D-integrated RF and millimeter-wave functions and modules using liquid crystal polymer (LCP) system-on-package technology MM Tentzeris, J Laskar, J Papapolymerou, S Pinel, V Palazzari, R Li, ...
IEEE Transactions on Advanced Packaging 27 (2), 332-340, 2004
123 2004 Highly integrated millimeter-wave passive components using 3-D LTCC system-on-package (SOP) technology JH Lee, G DeJean, S Sarkar, S Pinel, K Lim, J Papapolymerou, J Laskar, ...
IEEE transactions on microwave theory and techniques 53 (6), 2220-2229, 2005
121 2005 The next wireless wave is a millimeter wave J Laskar, S Pinel, D Dawn, S Sarkar, B Perumana, P Sen
Microwave Journal 50 (8), 22, 2007
113 2007 Design of compact stacked-patch antennas in LTCC multilayer packaging modules for wireless applications RL Li, G DeJean, M Maeng, K Lim, S Pinel, MM Tentzeris, J Laskar
IEEE Transactions on Advanced Packaging 27 (4), 581-589, 2004
110 2004 A compact LTCC-based Ku-band transmitter module CH Lee, A Sutono, S Han, K Lim, S Pinel, EM Tentzeris, J Laskar
IEEE Transactions on Advanced Packaging 25 (3), 374-384, 2002
110 2002 Wireless repeater assembly S Pinel, J Laskar
US Patent App. 11/394,911, 2006
98 2006 Receiver assembly and method for multi-gigabit wireless systems S Pinel, J Laskar
US Patent 7,593,704, 2009
86 2009 Fully integrated passive front-end solutions for a V-band LTCC wireless system JH Lee, N Kidera, S Pinel, J Laskar, MM Tentzeris
IEEE Antennas and Wireless Propagation Letters 6, 285-288, 2007
81 2007 Integrated RF architectures in fully-organic SOP technology MF Davis, A Sutono, SW Yoon, S Mandal, M Bushyager, CH Lee, K Lim, ...
IEEE Transactions on advanced packaging 25 (2), 136-142, 2002
81 2002 A 60-GHz 38-pJ/bit 3.5-Gb/s 90-nm CMOS OOK digital radio E Juntunen, MCH Leung, F Barale, A Rachamadugu, DA Yeh, ...
IEEE Transactions on Microwave Theory and Techniques 58 (2), 348-355, 2010
79 2010 Multi-gigabit millimeter wave receiver system and demodulator system E Juntunen, S Pinel, J Laskar, D Yeh, S Sarkar
US Patent 8,605,826, 2013
72 2013 Linear tapered cavity-backed slot antenna for millimeter-wave LTCC modules IK Kim, N Kidera, S Pinel, J Papapolymerou, J Laskar, JG Yook, ...
IEEE antennas and wireless propagation letters 5, 175-178, 2006
59 2006 3D integrated LTCC module using/spl mu/BGA technology for compact C-band RF front-end module S Pinel, S Chakraborty, M Roellig, R Kunze, S Mandal, H Liang, CH Lee, ...
2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No. 02CH37278 …, 2002
58 2002 Design and Development of Advanced Cavity-Based Dual-Mode Filters Using Low-Temperature Co-Fired Ceramic Technology for JH Lee, S Pinel, J Laskar, MM Tentzeris
IEEE transactions on microwave theory and techniques 55 (9), 1869-1879, 2007
53 2007 Thermal modeling and management in ultrathin chip stack technology S Pinel, A Marty, J Tasselli, JP Bailbe, E Beyne, R Van Hoof, S Marco, ...
IEEE Transactions on Components and Packaging Technologies 25 (2), 244-253, 2002
53 2002 Low-loss integrated-waveguide passive circuits using liquid-crystal polymer system-on-package (SOP) technology for millimeter-wave applications KS Yang, S Pinel, IK Kim, J Laskar
IEEE transactions on microwave theory and techniques 54 (12), 4572-4579, 2006
46 2006 