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Kang Rong Li
Kang Rong Li
Xi’an Microelectronics Technology Institute
Verified email at ime.a-star.edu.sg - Homepage
Title
Cited by
Cited by
Year
Inductive Coupled In-Circuit Impedance Monitoring of Electrical System Using Two-Port ABCD Network Approach
KR Li, KY See, XM Li
IEEE Transactions on instrumentation and measurement 64 (9), 2489-2495, 2015
502015
Design of 2.45 GHz microwave wireless power transfer system for battery charging applications
KR Li, KY See, WJ Koh, JW Zhang
2017 Progress in Electromagnetics Research Symposium-Fall (PIERS-FALL), 2417 …, 2017
352017
Systematic common-mode filter design for inverter-driven motor system based on in-circuit impedance extraction
F Fan, KY See, X Liu, K Li, AK Gupta
IEEE Transactions on Electromagnetic Compatibility 62 (5), 1711-1722, 2019
262019
Impact analysis of conducted emission measurement without LISN
KR Li, KY See, RMS Bandara
IEEE Transactions on Electromagnetic Compatibility 58 (3), 776-783, 2016
262016
On-line impedance monitoring of transformer based on inductive coupling approach
SB Rathnayaka, KY See, K Li
IEEE Transactions on Dielectrics and Electrical Insulation 24 (2), 1273-1279, 2017
252017
Inductively coupled on‐line impedance measurement for condition monitoring of electrical equipment
SB Rathnayaka, KY See, K Li
IET Science, Measurement & Technology 12 (3), 382-387, 2018
62018
Inductive coupling method for on-line frequency response analysis (FRA) for transformer winding diagnostic
SB Rathnayaka, KY See, M Prajapati, K Li, NB Narampanawe, F Fan
TENCON 2017-2017 IEEE Region 10 Conference, 88-92, 2017
62017
Evaluation of conducted EMI measurement without LISN using two-port ABCD network approach for EMI filter design under real operating condition
KR Li, KY See
2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), 632-635, 2015
62015
Study of signal integrity and radiated emission of single ended and differential high speed digital signals crossing a slot
LB Wang, KY See, WS Soh, KR Li, JW Zhang, T Svimonishvili
2012 Asia-Pacific Symposium on Electromagnetic Compatibility, 261-264, 2012
52012
Offline health diagnosis of power device based on nonintrusive inductively coupled approach
HC Yang, KY See, R Simanjorang, KR Li
IEEE Journal of Emerging and Selected Topics in Power Electronics 6 (4 …, 2018
42018
Study of EMI filter performance without LISN based on noise impedances
KR Li, KY See, F Fan
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility …, 2017
42017
In-circuit common-mode impedance measurement for motor drive system
F Fan, KY See, K Li, X Liu, MA Zagrodnik, AK Gupta
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility …, 2017
42017
Electrical characterization and design of hyper-dense interconnect on HD-FOWLP for die to die connectivity for AI and ML accelerator applications
MD Rotaru, L Kangrong
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 430-434, 2020
32020
Efficient inductive coupled in-circuit impedance extraction with enhanced SNR and instrument protection
F Fan, KY See, K Li, JK Banda, X Liu, AK Gupta
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 …, 2018
32018
Electrical design challenges in High Bandwidth Memory and Advanced Interface Bus interfaces on HD-FOWLP technology
MD Rotaru, L Kangrong
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 334-339, 2021
22021
Condition Monitoring of Power Feeder with Multiple Parallel Cables Based on Inductive Coupling Method
K Li, KY See, NB Narampanawe, A Weerasinghe, VHY Tong
2018 International Conference on Intelligent Rail Transportation (ICIRT), 1-4, 2018
22018
Estimation of deviation of conducted emission measurement without LISN
KR Li, KY See
2016 Asia-Pacific International Symposium on Electromagnetic Compatibility …, 2016
22016
EMI filter design to improve electromagnetic immunity of hearing aid devices
WS Soh, KY See, KR Li
2012 Asia-Pacific Symposium on Electromagnetic Compatibility, 942-944, 2012
22012
RF Performance Study of Through-Mold-Via (TMV) using L-2L De-Embedding Method
W Jiaqi, L Kangrong, LT Guan
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 343-346, 2021
12021
Testing multiple high-speed channels using automated test equipment (ATE), SOC 93K, in parallel
RB Umralkar, L Kangrong
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 405-409, 2021
12021
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