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Co-authors
- Jun ZhangHong Kong University of Science and Technology, IEEE FellowVerified email at ust.hk
- Khaled B. LetaiefMember of US National Academy of Engineering and New Bright Professor of Engineering, HKUSTVerified email at ust.hk
- Kaibin HuangProfessor and Head, Dept. of EEE, University of Hong Kong; IEEE Fellow; ISI Highly Cited ResearcherVerified email at eee.hku.hk
- Changsheng YouSouthern University of Science and TechnologyVerified email at sustech.edu.cn
- Jiawei ShaoHong Kong University of Science and TechnologyVerified email at connect.ust.hk
- Shenghui SongThe Hong Kong University of Science and TechnologyVerified email at ust.hk
- Yuchang SUNPh.D. candidate, HKUSTVerified email at connect.ust.hk
- Juan Liu (Tasia)Ningbo UniversityVerified email at nbu.edu.cn
- Zijian LiHong Kong University of Science and TechnologyVerified email at connect.ust.hk
- Zehong LinHong Kong University of Science and TechnologyVerified email at ust.hk
- Guanding YuZhejiang UniversityVerified email at zju.edu.cn
- Songze LiAssistant Professor, Hong Kong University of Science and TechnologyVerified email at ust.hk
- Caijun ZhongZhejiang UniversityVerified email at zju.edu.cn
- Zhaoyang ZhangZhejiang UniversityVerified email at zju.edu.cn
- Lumin LiuHKUSTVerified email at connect.ust.hk
- Shi JinSoutheast UniversityVerified email at seu.edu.cn
- Xinjie ZhangPhD student, Hong Kong University of Science and TechnologyVerified email at connect.ust.hk
- Zihao WangHKUSTVerified email at cse.ust.hk
- Dr. Bo BaiTheory Lab, Central Research Institute, 2012 Labs, Huawei Technologies Co., Ltd.Verified email at huawei.com
- Wu HaoAssociate Professor, Dept. of Mathematical Sciences, Tsinghua Univ.Verified email at tsinghua.edu.cn