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Khanh N. Dang
Khanh N. Dang
Other namesNam-Khanh Dang
University of Aizu
Verified email at ieee.org - Homepage
Title
Cited by
Cited by
Year
Scalable design methodology and online algorithm for TSV-cluster defects recovery in highly reliable 3D-NoC systems
KN Dang, AB Ahmed, Y Okuyama, AB Abdallah
IEEE Transactions on Emerging Topics in Computing 8 (3), 577 - 590, 2020
382020
On the design of a fault-tolerant scalable three dimensional NoC-based digital neuromorphic system with on-chip learning
OM Ikechukwu, KN Dang, AB Abdallah
IEEE Access 9, 64331-64345, 2021
272021
A low-overhead soft–hard fault-tolerant architecture, design and management scheme for reliable high-performance many-core 3D-NoC systems
KN Dang, M Meyer, Y Okuyama, AB Abdallah
The Journal of Supercomputing 73, 2705-2729, 2017
262017
A Soft-Error Resilient 3D Network-on-Chip Router
KN Dang, M Meyer, Y Okuyama, XT Tran, AB Abdallah
IEEE 7th International Conference on Awareness Science and Technology, 2015
232015
Toward Robust Cognitive 3D Brain-Inspired Cross-Paradigm System
A Ben Abdallah, KN Dang
Frontiers in Neuroscience, 795, 2021
202021
TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC systems
KN Dang, AB Ahmed, AB Abdallah, XT Tran
IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2019
182019
A Comprehensive Reliability Assessment of Fault-Resilient Network-on-Chip Using Analytical Model
KN Dang, AB Ahmed, XT Tran, Y Okuyama, AB Abdallah
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 25 (11 …, 2017
172017
FPGA implementation of a low latency and high throughput network-on-chip router architecture
NK Dang, TV Le Van, XT Tran
152011
Reliability assessment and quantitative evaluation of soft-error resilient 3D network-on-chip systems
KN Dang, M Meyer, Y Okuyama, AB Abdallah
2016 IEEE 25th Asian Test Symposium (ATS), 161-166, 2016
142016
Light-weight spiking neuron processing core for large-scale 3D-NoC based spiking neural network processing systems
M Ogbodo, T Vu, K Dang, A Abdallah
2020 IEEE international conference on big data and smart computing (BigComp …, 2020
132020
Migspike: A migration based algorithms and architecture for scalable robust neuromorphic systems
KN Dang, NAV Doan, AB Abdallah
IEEE Transactions on Emerging Topics in Computing 10 (2), 602-617, 2021
122021
TSV-IaS: Analytic Analysis and Low-Cost Non-Preemptive on-Line Detection and Correction Method for TSV Defects
KN Dang, AB Ahmed, BA Abderrazak, XT Tran
Proc. IEEE Computer Society Annual Symp. VLSI (ISVLSI), 501--506, 2019
122019
Parity-based ECC and Mechanism for Detecting and Correcting Soft Errors in On-Chip Communication
KN Dang, XT Tran
2018 IEEE 12th International Symposium on Embedded Multicore/Many-core …, 2018
122018
An Efficient Software-Hardware Design Framework for Spiking Neural Network Systems
KN Dang, AB Abdallah
The International Conference on Internet of Things, Embedded Systems and …, 2019
102019
Real-time uav attitude heading reference system using extended kalman filter for programmable soc
S Mie, Y Okuyama, Y Sato, Y Chan, NK Dang, BA Abderazek
2017 IEEE 11th International Symposium on Embedded Multicore/Many-core …, 2017
92017
Neuromorphic computing principles and organization
AB Abdallah, KN Dang
Springer, 2022
72022
A thermal-aware on-line fault tolerance method for TSV lifetime reliability in 3D-NoC systems
KN Dang, AB Ahmed, AB Abdallah, XT Tran
IEEE Access 8, 166642-166657, 2020
72020
Soft-error resilient Network-on-Chip for safety-critical applications
KN Dang, Y Okuyama, AB Abdallah
2016 International Conference on IC Design and Technology (ICICDT), 1-4, 2016
72016
Hotcluster: a thermal-aware defect recovery method for through-silicon-vias toward reliable 3-d ics systems
KN Dang, AB Ahmed, AB Abdallah, XT Tran
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2021
62021
H. 264/AVC hardware encoders and low-power features
NM Nguyen, E Beigne, S Lesecq, DH Bui, NK Dang, XT Tran
2014 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), 77-80, 2014
62014
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