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Co-authors
- Xinge YuAssociate Professor of Biomedical Engineering, City University of Hong KongVerified email at cityu.edu.hk
- Kuanming YaoCity University of Hong KongVerified email at my.cityu.edu.hk
- Dengfeng LiPostdoc Research Fellow, City University of Hong KongVerified email at my.cityu.edu.hk
- Xingcan HuangCity University of Hong KongVerified email at my.cityu.edu.hk
- Jingkun ZhouCity University of Hong KongVerified email at my.cityu.edu.hk
- Chun Ki YiuCity university of Hong Kong, PhD studentVerified email at my.cityu.edu.hk
- Tsz Hung WongMichigan State UniversityVerified email at msu.edu
- Zhaoqian XieProfessor of Engineering Mechanics, Dalian University of TechnologyVerified email at dlut.edu.cn
- zhan gaocityuVerified email at my.cityu.edu.hk
- ENMING SONGFudan UniversityVerified email at fudan.edu.cn
- Lingyun Wang (王凌云)School of Integrated Circuits, Shandong UniversityVerified email at sdu.edu.cn
- Takao SomeyaProfessor, Department of Electric and Electronic Engineering, The University of TokyoVerified email at ee.t.u-tokyo.ac.jp
- Tomoyuki YokotaUniversity of TokyoVerified email at ntech.t.u-tokyo.ac.jp