| Arbitrarily shaped 2.5 D circuits using stretchable interconnects embedded in thermoplastic polymers B Plovie, Y Yang, J Guillaume, S Dunphy, K Dhaenens, S Van Put, ... Advanced Engineering Materials 19 (8), 2017 | 50 | 2017 |
| Design and Integration of Flexible Sensor Matrix for in Situ Monitoring of Polymer Composites Y Yang, G Chiesura, B Plovie, T Vervust, G Luyckx, J Degrieck, T Sekitani, ... ACS sensors 3 (9), 1698-1705, 2018 | 34 | 2018 |
| Arbitrarily Shaped 2.5 D Circuits Using stretchable interconnections and embedding in thermoplastic polymers J Vanfleteren, I Chtioui, B Plovie, Y Yang, F Bossuyt, T Vervust, S Dunphy, ... Procedia Technology 15, 208-215, 2014 | 22 | 2014 |
| Fully Integrated Flexible Dielectric Monitoring Sensor System for Real-Time In Situ Prediction of the Degree of Cure and Glass Transition Temperature of an Epoxy … Y Yang, B Plovie, G Chiesura, T Vervust, L Daelemans, DE Mogosanu, ... IEEE Transactions on Instrumentation and Measurement 70, 1-9, 2021 | 19 | 2021 |
| A new technology for rigid 3D free-form electronics based on the thermoplastic deformation of flat standard PCB type circuits J Vanfleteren, F Bossuyt, B Plovie 2016 12th International Congress Molded Interconnect Devices (MID), 1-4, 2016 | 15 | 2016 |
| Design automation of meandered interconnects for stretchable circuits B Plovie, J Vanfleteren, T Vervust, AV Quintero, F Bossuyt IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2018 | 13 | 2018 |
| Stretchability—The Metric for Stretchable Electrical Interconnects B Plovie, F Bossuyt, J Vanfleteren Micromachines 9 (8), 382, 2018 | 8 | 2018 |
| 2.5 D Smart Objects Using Thermoplastic Stretchable Interconnects B Plovie, S Dunphy, K Dhaenens, S Van Put, B Vandecasteele, F Bossuyt, ... International Symposium on Microelectronics 2015 (1), 000868-000873, 2015 | 8 | 2015 |
| One-time deformable thermoplastic devices based on flexible circuit board technology B Plovie, Y Yang, J Guillaume, S Dunphy, K Dhaenens, S Van Put, ... 2016 11th International Microsystems, Packaging, Assembly and Circuits …, 2016 | 7 | 2016 |
| Free-form 2.5 D thermoplastic circuits using one-time stretchable interconnections J Vanfleteren, B Plovie, Y Yang, J De Smet, R Verplancke, F Bossuyt, ... MRS Online Proceedings Library (OPL) 1798, 2015 | 6 | 2015 |
| Flex PCB based technology for randomly shaped circuits J Vanfleteren, F Bossuyt, B Plovie Proc. EIPC Summer Conference, 2017 | 5 | 2017 |
| Soft and Stretchable Electronics Design Y Yang, S Ding, B Plovie, W Li, C Shang | 4 | 2021 |
| Stretchable Mould Interconnect Optimization: Peeling Automation and Carrierless Techniques B Plovie, Y Yang, S Dunphy, K Dhaenens, S Van Put, F Bossuyt, ... IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019 | 3 | 2019 |
| Thermoplastic electronic circuits: design, technology and characterisation B Plovie Ghent University, 2019 | 3 | 2019 |
| Capacitive sensor network for composites production monitoring Y Yang, B Plovie, T Vervust, J Vanfleteren 2016 IEEE SENSORS, 1-3, 2016 | 3 | 2016 |
| Method for Manufacturing Shape-Retaining Non-Flat Devices J Vanfleteren, F Bossuyt, B Plovie US Patent App. 16/336,004, 2020 | | 2020 |
| Fabrication of fixed-shape soft smart objects by thermoplastic forming of flat stretchable circuits AF Vasquez Quintero, J Vanfleteren, F Bossuyt, B Plovie, R Verplancke, ... 2017 MRS Spring Meeting, Symposium SM4. 9: Soft Systems and Liquid-Metal …, 2017 | | 2017 |
| Thermoplastically Shaped Wearable Medical Devices B Plovie, S Dunphy, K Dhaenens, S Van Put, B Vandecasteele, F Bossuyt, ... Proc. 39th Annual International Conference of the IEEE Engineering in …, 2017 | | 2017 |
Jan VanfleterenPrincipal Member of Technical Staff, imec; Professor, Ghent University, BelgiumVerified email at imec.be
