| Polycrystalline CdSe films for thin film transistors A Van Calster, A Vervaet, I De Rycke, J De Baets, J Vanfleteren Journal of Crystal Growth 86 (1-4), 924-928, 1988 | 83 | 1988 |
| Systems-in-foil–Devices, fabrication processes and reliability issues J Van den Brand, J De Baets, T Van Mol, A Dietzel Microelectronics Reliability 48 (8-9), 1123-1128, 2008 | 73 | 2008 |
| Broadband material parameter characterization for practical high-speed interconnects on printed circuit board M Cauwe, J De Baets IEEE transactions on advanced packaging 31 (3), 649-656, 2008 | 53 | 2008 |
| Stretchable circuits with horseshoe shaped conductors embedded in elastic polymers A Jahanshahi, M Gonzalez, J van den Brand, F Bossuyt, T Vervust, ... Japanese Journal of Applied Physics 52 (5S1), 05DA18, 2013 | 51 | 2013 |
| Stabilizer concentration and local environment: Their effects on electroless nickel plating of PCB micropads S Zhang, J De Baets, M Vereeken, A Vervaet, A Van Calster Journal of the Electrochemical Society 146 (8), 2870, 1999 | 41 | 1999 |
| On the field effect in polycrystalline CdSe thin‐film transistors A Van Calster, J Vanfleteren, I De Rycke, J De Baets Journal of applied physics 64 (6), 3282-3286, 1988 | 39 | 1988 |
| Introduction of amino groups on the surface of thin photo definable epoxy resin layers via chemical modification D Schaubroeck, J De Baets, T Desmet, S Van Vlierberghe, E Schacht, ... Applied Surface Science 255 (21), 8780-8787, 2009 | 37 | 2009 |
| Industrial and technical aspects of chip embedding technology A Ostmann, D Manessis, J Stahr, M Beesley, M Cauwe, J De Baets 2008 2nd Electronics System-Integration Technology Conference, 315-320, 2008 | 37 | 2008 |
| Surface modification of a photo-definable epoxy resin with polydopamine to improve adhesion with electroless deposited copper D Schaubroeck, E Van Den Eeckhout, J De Baets, P Dubruel, ... Journal of adhesion science and technology 26 (18-19), 2301-2314, 2012 | 30 | 2012 |
| Surface modification of an epoxy resin with polyamines via cyanuric chloride coupling D Schaubroeck, J De Baets, T Desmet, P Dubruel, E Schacht, ... Applied Surface Science 256 (21), 6269-6278, 2010 | 27 | 2010 |
| Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers S Siau, A Vervaet, L Degrendele, J De Baets, A Van Calster Applied surface science 252 (8), 2717-2740, 2006 | 26 | 2006 |
| Process to create metallic stand-offs on an electronic circuit JAF Peeters, LJ Vandam, KJG Allaert, AM Ackaert, AM Van Calster, ... US Patent 6,036,836, 2000 | 24 | 2000 |
| 9.4: Stretchable 45× 80 rgb led display using meander wiring technology H Ohmae, Y Tomita, M Kasahara, J Schram, E Smits, J Van den Brand, ... SID Symposium Digest of Technical Papers 46 (1), 102-105, 2015 | 22 | 2015 |
| Technology development for a low-cost, roll-to-roll chip embedding solution based on PET foils M Cauwe, B Vandecasteele, A Gielen, J De Baets, J van den Brand, ... 18th European Microelectronics & Packaging Conference, 1-6, 2011 | 22 | 2011 |
| Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards S Siau, J De Baets, A Van Calster, L Heremans, S Tanghe Microelectronics Reliability 45 (3-4), 675-687, 2005 | 21 | 2005 |
| Ultra-thin chip technology and applications A Dietzel, J van den Brand, J Vanfleteren, W Christiaens, E Bosman, ... edited by JN Burghartz (Springer Verlag, New York, 2011), 141-157, 2011 | 20 | 2011 |
| High-voltage polycrystalline CdSe thin-film transistors J De Baets, J Vanfleteren, I De Rycke, J Doutreloigne, A Van Calster, ... IEEE transactions on electron devices 37 (3), 636-639, 1990 | 20 | 1990 |
| Ultra-thin biocompatible implantable chip for bidirectional communication with peripheral nerves MO de Beeck, R Verplancke, D Schaubroeck, D Cuypers, M Cauwe, ... 2017 IEEE Biomedical Circuits and Systems Conference (BioCAS), 1-4, 2017 | 19 | 2017 |
| Flexible and stretchable electronics for wearable healthcare J van den Brand, M de Kok, A Sridhar, M Cauwe, R Verplancke, F Bossuyt, ... 2014 44th European Solid State Device Research Conference (ESSDERC), 206-209, 2014 | 19 | 2014 |
| An Anisotropie Adhesive Flip-Chip Technology for LCD Drivers M Vrana, J De Baets, A Van Calster, D Wojciechowski Digest of Technical papers, Vol. 27, SID, San Diego, California, mei pp. 929-932, 1996 | 18 | 1996 |
