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Aditya Kumar
Aditya Kumar
GLOBALFOUNDRIES US Inc.
Verified email at globalfoundries.com
Title
Cited by
Cited by
Year
Study of 15µm pitch solder microbumps for 3D IC integration
A Yu, JH Lau, SW Ho, A Kumar, WY Hnin, DQ Yu, MC Jong, V Kripesh, ...
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th, 6-10, 2009
872009
Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5 Ag solder and electroless Ni–P metallization on Cu substrate
A Kumar, Z Chen, SG Mhaisalkar, CC Wong, PS Teo, V Kripesh
Thin Solid Films 504 (1), 410-415, 2006
862006
Fabrication of high aspect ratio TSV and assembly with fine-pitch low-cost solder microbump for Si interposer technology with high-density interconnects
A Yu, JH Lau, SW Ho, A Kumar, WY Hnin, WS Lee, MC Jong, VN Sekhar, ...
Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011
742011
Wafer level embedding technology for 3D wafer level embedded package
A Kumar, X Dingwei, VN Sekhar, S Lim, C Keng, G Sharma, VS Rao, ...
Proceedings of the 59th electronic components and technology conference …, 2009
682009
Solutions strategies for die shift problem in wafer level compression molding
G Sharma, A Kumar, VS Rao, SW Ho, V Kripesh
Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011
622011
Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps
A Yu, JH Lau, SW Ho, A Kumar, HW Yin, JM Ching, V Kripesh, D Pinjala, ...
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th, 350-354, 2009
612009
Barrier properties of thin Au/Ni–P under bump metallization for Sn–3.5 Ag solder
A Kumar, M He, Z Chen
Surface and Coatings Technology 198 (1), 283-286, 2005
602005
Design and development of a multi-die embedded micro wafer level package
V Kripesh, VS Rao, A Kumar, G Sharma, KC Houe, Z Xiaowu, KY Mong, ...
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, 1544 …, 2008
592008
Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder
A Kumar, M He, Z Chen, PS Teo
Thin Solid Films 462, 413-418, 2004
582004
A novel method to predict die shift during compression molding in embedded wafer level package
CH Khong, A Kumar, X Zhang, G Sharma, SR Vempati, K Vaidyanathan, ...
Proc. Electron. Compon. Technol. Conf, 535-541, 2009
532009
Interdependent intermetallic compound growth in an electroless Ni-P/Sn-3.5 Ag reaction couple
A Kumar, Z Chen
Journal of electronic materials 40 (2), 213-223, 2011
462011
Application of piezoresistive stress sensors in ultra thin device handling and characterization
X Zhang, A Kumar, QX Zhang, YY Ong, SW Ho, CH Khong, V Kripesh, ...
Sensors and Actuators A: Physical 156 (1), 2-7, 2009
422009
Embedded wafer level packages with laterally placed and vertically stacked thin dies
G Sharma, VS Rao, A Kumar, N Su, LY Ying, KC Houe, S Lim, VN Sekhar, ...
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th, 1537 …, 2009
422009
Effect of electromigration on the mechanical performance of Sn-3.5 Ag solder joints with Ni and Ni-P metallizations
A Kumar, Y Yang, CC Wong, V Kripesh, Z Chen
Journal of Electronic Materials 38 (1), 78-87, 2009
392009
Alternative materials for high numerical aperture extreme ultraviolet lithography mask stacks
O Wood, S Raghunathan, P Mangat, V Philipsen, V Luong, P Kearney, ...
SPIE Proceedings 9422, 2015
372015
Interfacial reaction between Sn-rich solders and Ni-based metallization
M He, A Kumar, PT Yeo, GJ Qi, Z Chen
Thin Solid Films 462, 387-394, 2004
372004
Development of fine pitch solder microbumps for 3D chip stacking
A Yu, A Kumar, SW Ho, HW Yin, JH Lau, KC Houe, SLP Siang, X Zhang, ...
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th, 387-392, 2008
362008
Effect of phosphorus content on Cu/Ni-P/Sn-3.5 Ag solder joint strength after multiple reflows
Z Chen, A Kumar, M Mona
Journal of electronic materials 35 (12), 2126-2134, 2006
342006
Effect of interfacial reaction on the tensile strength of Sn-3.5 Ag/Ni-P and Sn-37Pb/Ni-P solder joints
Z Chen, M He, A Kumar, GJ Qi
Journal of electronic materials 36 (1), 17-25, 2007
322007
Residual stress analysis in thin device wafer using piezoresistive stress sensor
A Kumar, X Zhang, QX Zhang, MC Jong, G Huang, LWS Vincent, ...
Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011
272011
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