| Microstructure and mechanical properties of sintered Ag particles with flake and spherical shape from nano to micro size C Chen, K Suganuma Materials & Design 162, 311-321, 2019 | 141 | 2019 |
| Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air Z Zhang, C Chen, Y Yang, H Zhang, D Kim, T Sugahara, S Nagao, ... Journal of Alloys and Compounds 780, 435-442, 2019 | 121 | 2019 |
| High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates C Chen, K Suganuma, T Iwashige, K Sugiura, K Tsuruta Journal of Materials Science: Materials in Electronics 29, 1785-1797, 2018 | 96 | 2018 |
| Mechanical deformation of sintered porous Ag die attach at high temperature and its size effect for wide-bandgap power device design C Chen, S Nagao, H Zhang, J Jiu, T Sugahara, K Suganuma, T Iwashige, ... Journal of Electronic Materials 46, 1576-1586, 2017 | 90 | 2017 |
| Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere Y Gao, W Li, C Chen, H Zhang, J Jiu, CF Li, S Nagao, K Suganuma Materials & Design 160, 1265-1272, 2018 | 89 | 2018 |
| Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices C Chen, S Nagao, K Suganuma, J Jiu, T Sugahara, H Zhang, T Iwashige, ... Acta Materialia 129, 41-51, 2017 | 86 | 2017 |
| Printable and flexible copper–silver alloy electrodes with high conductivity and ultrahigh oxidation resistance W Li, D Hu, L Li, CF Li, J Jiu, C Chen, T Ishina, T Sugahara, K Suganuma ACS applied materials & interfaces 9 (29), 24711-24721, 2017 | 82 | 2017 |
| High-temperature reliability of low-temperature and pressureless micron Ag sintered joints for die attachment in high-power device H Zhang, C Chen, J Jiu, S Nagao, K Suganuma Journal of Materials Science: Materials in Electronics 29, 8854-8862, 2018 | 75 | 2018 |
| Bonding technology based on solid porous Ag for large area chips C Chen, S Noh, H Zhang, C Choe, J Jiu, S Nagao, K Suganuma Scripta Materialia 146, 123-127, 2018 | 64 | 2018 |
| Highly reliable and highly conductive submicron Cu particle patterns fabricated by low temperature heat-welding and subsequent flash light sinter-reinforcement W Li, H Zhang, Y Gao, J Jiu, CF Li, C Chen, D Hu, Y Goya, Y Wang, ... Journal of Materials Chemistry C 5 (5), 1155-1164, 2017 | 60 | 2017 |
| Effect of electroplated Au layer on bonding performance of Ag pastes T Fan, H Zhang, P Shang, C Li, C Chen, J Wang, Z Liu, K Suganuma Journal of Alloys and compounds 731, 1280-1287, 2018 | 58 | 2018 |
| Self-healing of cracks in Ag joining layer for die-attachment in power devices C Chen, S Nagao, K Suganuma, J Jiu, H Zhang, T Sugahara, T Iwashige, ... Applied Physics Letters 109 (9), 2016 | 57 | 2016 |
| Reliability evaluation of SiC power module with sintered Ag die attach and stress-relaxation structure K Sugiura, T Iwashige, K Tsuruta, C Chen, S Nagao, T Funaki, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (4 …, 2019 | 54 | 2019 |
| Online thermal resistance and reliability characteristic monitoring of power modules with Ag sinter joining and Pb, Pb-free solders during power cycling test by SiC TEG chip D Kim, S Nagao, C Chen, N Wakasugi, Y Yamamoto, A Suetake, ... IEEE Transactions on Power Electronics 36 (5), 4977-4990, 2020 | 50 | 2020 |
| Robust bonding and thermal-stable Ag–Au joint on ENEPIG substrate by micron-scale sinter Ag joining in low temperature pressure-less C Chen, Z Zhang, Q Wang, B Zhang, Y Gao, T Sasamura, Y Oda, N Ma, ... Journal of Alloys and Compounds 828, 154397, 2020 | 46 | 2020 |
| Thermal fatigue behavior of silicon-carbide-doped silver microflake sinter joints for die attachment in silicon/silicon carbide power devices H Zhang, C Chen, S Nagao, K Suganuma Journal of Electronic Materials 46, 1055-1060, 2017 | 45 | 2017 |
| Effects of rotation tool-induced heat and material flow behaviour on friction stir lapped Al/steel joint formation and resultant microstructure P Geng, Y Ma, N Ma, H Ma, Y Aoki, H Liu, H Fujii, C Chen International Journal of Machine Tools and Manufacture 174, 103858, 2022 | 44 | 2022 |
| Alloying and embedding of Cu-core/Ag-shell nanowires for ultrastable stretchable and transparent electrodes B Zhang, W Li, M Nogi, C Chen, Y Yang, T Sugahara, H Koga, ... ACS applied materials & interfaces 11 (20), 18540-18547, 2019 | 44 | 2019 |
| Ag particles for sinter bonding: Flakes or spheres? J Yeom, S Nagao, C Chen, T Sugahara, H Zhang, C Choe, CF Li, ... Applied Physics Letters 114 (25), 2019 | 41 | 2019 |
| Electrochemical behavior of Zn-xSn high-temperature solder alloys in 0.5 M NaCl solution Z Wang, C Chen, J Jiu, S Nagao, M Nogi, H Koga, H Zhang, G Zhang, ... Journal of Alloys and Compounds 716, 231-239, 2017 | 39 | 2017 |
