| The evolution of packages for monolithic microwave and millimeter-wave circuits TA Midford, JJ Wooldridge, RL Sturdivant IEEE Transactions on antennas and propagation 43 (9), 983-991, 1995 | 71 | 1995 |
| Balun Designs for Wireless,... Mixers, Amplifiers and Antennas R Sturdivant APPLIED MICROWAVE AND WIRELESS 5, 34-34, 1993 | 57 | 1993 |
| Systems engineering baseline concept of a multispectral drone detection solution for airports RL Sturdivant, EKP Chong IEEE Access 5, 7123-7138, 2017 | 53 | 2017 |
| Microwave vertical interconnect through circuit with compressible conductor RL Sturdivant, C Quan US Patent 5,552,752, 1996 | 51 | 1996 |
| Systems engineering of a terabit elliptic orbit satellite and phased array ground station for IoT connectivity and consumer internet access RL Sturdivant, EKP Chong IEEE Access 4, 9941-9957, 2016 | 44 | 2016 |
| Book: Microwave and Millimeter-wave Electronic Packaging R Sturdivant Artech House, 2013 | 41 | 2013 |
| Location determination system and method using array elements for location tracking R Sturdivant, JF Brown, C Turner US Patent App. 13/349,565, 2013 | 39 | 2013 |
| Reducing the effects of the mounting substrate on the performance of GaAs MMIC flip chips R Sturdivant Proceedings of 1995 IEEE MTT-S International Microwave Symposium, 1591-1595, 1995 | 38 | 1995 |
| Design and performance of a high density 3D microwave module R Sturdivant, C Ly, J Benson, M Hauhe 1997 IEEE MTT-S International Microwave Symposium Digest 2, 501-504, 1997 | 37 | 1997 |
| Microwave compression interconnect using dielectric filled three-wire line with compressible conductors CS Howard, RL Sturdivant, C Quan, JJ Wooldridge US Patent 5,675,302, 1997 | 34 | 1997 |
| Direct three-wire to stripline connection RL Sturdivant US Patent 5,689,216, 1997 | 30 | 1997 |
| Book: Transmit Receive Modules for Radar and Communication Systems R Sturdivant, M Harris Artech House, 2015 | 29 | 2015 |
| Systems Engineering of Phased Arrays R Sturdivant, C Quan, E Chang Artech House, 2018 | 24 | 2018 |
| Investigation of MMIC flip chips with sealants for improved reliability without hermeticity R Sturdivant, C Quan, J Wooldridge 1996 IEEE MTT-S International Microwave Symposium Digest 1, 239-242, 1996 | 20 | 1996 |
| Wireless Mobile Communication System Rewards Royalty System and Method C Turner, R Sturdivant, JF Brown US Patent App. 13/477,117, 2013 | 15 | 2013 |
| Dielectric notch radiator antennas with integrated filtering for 5G and IoT access R Sturdivant, EKP Chong 2017 IEEE radio and wireless symposium (RWS), 197-200, 2017 | 14 | 2017 |
| Special issue on interconnects and packaging VK Tripathi, R Sturdivant IEEE Transactions on Microwave Theory and Techniques 45 (10), 1817-1818, 1997 | 14 | 1997 |
| Systems engineering of IoT connected commercial airliners using satellite backhaul links RL Sturdivant, J Lee 2018 IEEE Topical Workshop on Internet of Space (TWIOS), 1-4, 2018 | 13 | 2018 |
| Pico-hydro electric power in the nepal himalayas R Sturdivant, J Yeh, M Stambaugh, A Zahnd, EKP Chong 2017 Ninth Annual IEEE Green Technologies Conference (GreenTech), 232-237, 2017 | 12 | 2017 |
| Modular pico-hydropower system for remote himalayan villages A Zahnd, M Stambaugh, D Jackson, T Gross, C Hugi, R Sturdivant, J Yeh, ... Transition Towards 100% Renewable Energy: Selected Papers from the World …, 2018 | 11 | 2018 |
