| In Situ Experiments To Reveal the Role of Surface Feature Sidewalls in the Cassie–Wenzel Transition R Hensel, A Finn, R Helbig, S Killge, HG Braun, C Werner Langmuir 30 (50), 15162-15170, 2014 | 48 | 2014 |
| 3D system integration on 300 mm wafer level: High-aspect-ratio TSVs with ruthenium seed layer by thermal ALD and subsequent copper electroplating S Killge, I Bartusseck, M Junige, V Neumann, J Reif, C Wenzel, ... Microelectronic Engineering 205, 20-25, 2019 | 17 | 2019 |
| TSV transistor—Vertical metal gate FET inside a through silicon via F Winkler, S Killge, D Fischer, K Richter, A Hiess, JW Bartha IEEE Electron Device Letters 39 (10), 1493-1496, 2018 | 13 | 2018 |
| In vacuo studies on plasma-enhanced atomic layer deposition of cobalt thin films J Reif, M Knaut, S Killge, F Winkler, M Albert, JW Bartha Journal of Vacuum Science & Technology A 38 (1), 2020 | 11 | 2020 |
| Demonstration of a graphene-base heterojunction transistor with saturated output current C Strobel, CA Chavarin, B Leszczynska, S Leszczynski, F Winkler, ... Journal of Applied Physics 125 (23), 2019 | 11 | 2019 |
| Copper-based TSV: Interposer S Killge, V Neumann, JW Bartha 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems, 9-28, 2016 | 11 | 2016 |
| 3D optical coupling techniques on polymer waveguides for wafer and board level integration S Lüngen, S Charania, T Tiedje, K Nieweglowski, S Killge, L Lorenz, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1612-1618, 2017 | 10 | 2017 |
| Towards the realization of optical interconnets on Si interposer S Killge, S Charania, K Richter, JW Bartha 2016 IEEE International Interconnect Technology Conference/Advanced …, 2016 | 10 | 2016 |
| Optical through-silicon vias S Killge, N Neumann, D Plettemeier, JW Bartha 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems, 221-234, 2016 | 9 | 2016 |
| Modeling and characterization of optical TSVs N Neumann, S Charania, S Killge, Z al-Husseini, R Henker, F Ellinger, ... Optical Fibers and Their Applications 2017 10325, 169-176, 2017 | 8 | 2017 |
| Design, fabrication, and comparison of 3D multimode optical interconnects on silicon interposer S Charania, N Neumann, S Killge, F Winkler, Z Al-Husseini, L Szilagyi, ... Journal of Lightwave Technology 38 (13), 3454-3460, 2020 | 5 | 2020 |
| Bioadhesion on Textured Interfaces in the Human Oral Cavity—An In Situ Study R Helbig, M Hannig, S Basche, J Ortgies, S Killge, C Hannig, ... International Journal of Molecular Sciences 23 (3), 1157, 2022 | 4 | 2022 |
| In situ studies on atomic layer etching of aluminum oxide using sequential reactions with trimethylaluminum and hydrogen fluoride J Reif, M Knaut, S Killge, M Albert, T Mikolajick, JW Bartha Journal of Vacuum Science & Technology A 40 (3), 2022 | 3 | 2022 |
| In vacuo investigations on the nucleation of TaCN by plasma enhanced atomic layer deposition J Reif, M Knaut, S Killge, M Albert, JW Bartha Microelectronic Engineering 211, 13-17, 2019 | 3 | 2019 |
| Micro structured coupling elements for 3D silicon optical interposer S Charania, S Lüngen, Z Al-Husseini, S Killge, K Nieweglowski, ... Integrated Optics: Physics and Simulations III 10242, 176-185, 2017 | 3 | 2017 |
| Realization of optical multimode TSV waveguides for Si-Interposer in 3D-chip-stacks S Killge, S Charania, K Richter, N Neumann, Z Al-Husseini, D Plettemeier, ... Micro-structured and Specialty Optical Fibres V 10232, 141-149, 2017 | 3 | 2017 |
| Introduction to Electrical 3D Integration S Killge, S Charania, JW Bartha 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems, 3-7, 2016 | 1 | 2016 |
| Deformations of soft imprint templates in the nanoimprint lithography J He, S Howitz, S Killge, K Richter, JW Bartha Alternative Lithographic Technologies IV 8323, 262-268, 2012 | 1 | 2012 |
| Modeling and characterization of optical TSVs S Killge, S Charania, N Neumann, Z Al-Husseini, D Plettemeier, ... | | 2017 |
| Micro structured coupling elements for 3D silicon optical interposer S Killge, S Charania, S Lüngen, N Neumann, Z Al-Husseini, D Plettemeier, ... | | 2017 |
