Sebastian Killge
Sebastian Killge
Verified email at tu-dresden.de
Title
Cited by
Cited by
Year
In Situ Experiments To Reveal the Role of Surface Feature Sidewalls in the Cassie–Wenzel Transition
R Hensel, A Finn, R Helbig, S Killge, HG Braun, C Werner
Langmuir 30 (50), 15162-15170, 2014
342014
Copper-based TSV: Interposer
S Killge, V Neumann, JW Bartha
3D Stacked Chips, 9-28, 2016
72016
Towards the realization of optical interconnets on Si interposer
S Killge, S Charania, K Richter, JW Bartha
2016 IEEE International Interconnect Technology Conference/Advanced …, 2016
62016
Optical through-silicon vias
S Killge, N Neumann, D Plettemeier, JW Bartha
3D Stacked Chips, 221-234, 2016
62016
3D System Integration on 300 mm wafer level: High-aspect-ratio TSVs with ruthenium seed layer by thermal ALD and subsequent copper electroplating
S Killge, I Bartusseck, M Junige, V Neumann, J Reif, C Wenzel, ...
Microelectronic Engineering 205, 20-25, 2019
42019
Modeling and characterization of optical TSVs
N Neumann, S Charania, S Killge, Z al-Husseini, R Henker, F Ellinger, ...
Optical Fibers and Their Applications 2017 10325, 103250O, 2017
42017
Demonstration of a graphene-base heterojunction transistor with saturated output current
C Strobel, CA Chavarin, B Leszczynska, S Leszczynski, F Winkler, ...
Journal of Applied Physics 125 (23), 234501, 2019
22019
TSV transistor—vertical metal gate FET inside a through silicon VIA
F Winkler, S Killge, D Fischer, K Richter, A Hiess, JW Bartha
IEEE Electron Device Letters 39 (10), 1493-1496, 2018
22018
3D optical coupling techniques on polymer waveguides for wafer and board level integration
S Lüngen, S Charania, T Tiedje, K Nieweglowski, S Killge, L Lorenz, ...
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1612-1618, 2017
22017
Micro structured coupling elements for 3D silicon optical interposer
S Charania, S Lüngen, Z Al-Husseini, S Killge, K Nieweglowski, ...
Integrated Optics: Physics and Simulations III 10242, 102420V, 2017
22017
Deformations of soft imprint templates in the nanoimprint lithography
J He, S Howitz, S Killge, K Richter, JW Bartha
Alternative Lithographic Technologies IV 8323, 83231B, 2012
22012
Design, Fabrication and Comparison of 3D Multimode Optical Interconnects on Silicon Interposer
S Charania, N Neumann, S Killge, F Winkler, Z Al-husseini, L Szilagyi, ...
Journal of Lightwave Technology, 2020
12020
In vacuo studies on plasma-enhanced atomic layer deposition of cobalt thin films
J Reif, M Knaut, S Killge, F Winkler, M Albert, JW Bartha
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 38 (1 …, 2020
12020
In vacuo investigations on the nucleation of TaCN by plasma enhanced atomic layer deposition
J Reif, M Knaut, S Killge, M Albert, JW Bartha
Microelectronic Engineering 211, 13-17, 2019
12019
Realization of optical multimode TSV waveguides for Si-Interposer in 3D-chip-stacks
S Killge, S Charania, K Richter, N Neumann, Z Al-Husseini, D Plettemeier, ...
Micro-structured and Specialty Optical Fibres V 10232, 102320T, 2017
12017
Modeling and characterization of optical TSVs
S Killge, S Charania, N Neumann, Z Al-Husseini, D Plettemeier, ...
2017
Micro structured coupling elements for 3D silicon optical interposer
S Killge, S Charania, S Lüngen, N Neumann, Z Al-Husseini, D Plettemeier, ...
2017
Introduction to Electrical 3D Integration
S Killge, S Charania, JW Bartha
3D Stacked Chips, 3-7, 2016
2016
High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
S Killge, J Reif, V Neumann, M Junige, M Geidel, C Wenzel, M Knaut, ...
3D integration: ALD ruthenium layers grown on metallic and oxide interfaces for TSV with high aspect ratios–why blisters?
S Killge, M Junige, M Geidel, V Neumann, C Wenzel, M Knaut, M Albert, ...
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Articles 1–20