| In Situ Experiments To Reveal the Role of Surface Feature Sidewalls in the Cassie–Wenzel Transition R Hensel, A Finn, R Helbig, S Killge, HG Braun, C Werner Langmuir 30 (50), 15162-15170, 2014 | 34 | 2014 |
| Copper-based TSV: Interposer S Killge, V Neumann, JW Bartha 3D Stacked Chips, 9-28, 2016 | 7 | 2016 |
| Towards the realization of optical interconnets on Si interposer S Killge, S Charania, K Richter, JW Bartha 2016 IEEE International Interconnect Technology Conference/Advanced …, 2016 | 6 | 2016 |
| Optical through-silicon vias S Killge, N Neumann, D Plettemeier, JW Bartha 3D Stacked Chips, 221-234, 2016 | 6 | 2016 |
| 3D System Integration on 300 mm wafer level: High-aspect-ratio TSVs with ruthenium seed layer by thermal ALD and subsequent copper electroplating S Killge, I Bartusseck, M Junige, V Neumann, J Reif, C Wenzel, ... Microelectronic Engineering 205, 20-25, 2019 | 4 | 2019 |
| Modeling and characterization of optical TSVs N Neumann, S Charania, S Killge, Z al-Husseini, R Henker, F Ellinger, ... Optical Fibers and Their Applications 2017 10325, 103250O, 2017 | 4 | 2017 |
| Demonstration of a graphene-base heterojunction transistor with saturated output current C Strobel, CA Chavarin, B Leszczynska, S Leszczynski, F Winkler, ... Journal of Applied Physics 125 (23), 234501, 2019 | 2 | 2019 |
| TSV transistor—vertical metal gate FET inside a through silicon VIA F Winkler, S Killge, D Fischer, K Richter, A Hiess, JW Bartha IEEE Electron Device Letters 39 (10), 1493-1496, 2018 | 2 | 2018 |
| 3D optical coupling techniques on polymer waveguides for wafer and board level integration S Lüngen, S Charania, T Tiedje, K Nieweglowski, S Killge, L Lorenz, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1612-1618, 2017 | 2 | 2017 |
| Micro structured coupling elements for 3D silicon optical interposer S Charania, S Lüngen, Z Al-Husseini, S Killge, K Nieweglowski, ... Integrated Optics: Physics and Simulations III 10242, 102420V, 2017 | 2 | 2017 |
| Deformations of soft imprint templates in the nanoimprint lithography J He, S Howitz, S Killge, K Richter, JW Bartha Alternative Lithographic Technologies IV 8323, 83231B, 2012 | 2 | 2012 |
| Design, Fabrication and Comparison of 3D Multimode Optical Interconnects on Silicon Interposer S Charania, N Neumann, S Killge, F Winkler, Z Al-husseini, L Szilagyi, ... Journal of Lightwave Technology, 2020 | 1 | 2020 |
| In vacuo studies on plasma-enhanced atomic layer deposition of cobalt thin films J Reif, M Knaut, S Killge, F Winkler, M Albert, JW Bartha Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 38 (1 …, 2020 | 1 | 2020 |
| In vacuo investigations on the nucleation of TaCN by plasma enhanced atomic layer deposition J Reif, M Knaut, S Killge, M Albert, JW Bartha Microelectronic Engineering 211, 13-17, 2019 | 1 | 2019 |
| Realization of optical multimode TSV waveguides for Si-Interposer in 3D-chip-stacks S Killge, S Charania, K Richter, N Neumann, Z Al-Husseini, D Plettemeier, ... Micro-structured and Specialty Optical Fibres V 10232, 102320T, 2017 | 1 | 2017 |
| Modeling and characterization of optical TSVs S Killge, S Charania, N Neumann, Z Al-Husseini, D Plettemeier, ... | | 2017 |
| Micro structured coupling elements for 3D silicon optical interposer S Killge, S Charania, S Lüngen, N Neumann, Z Al-Husseini, D Plettemeier, ... | | 2017 |
| Introduction to Electrical 3D Integration S Killge, S Charania, JW Bartha 3D Stacked Chips, 3-7, 2016 | | 2016 |
| High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating S Killge, J Reif, V Neumann, M Junige, M Geidel, C Wenzel, M Knaut, ... | | |
| 3D integration: ALD ruthenium layers grown on metallic and oxide interfaces for TSV with high aspect ratios–why blisters? S Killge, M Junige, M Geidel, V Neumann, C Wenzel, M Knaut, M Albert, ... | | |
