Seuraa
Jian Song
Jian Song
Muut nimetJ. Song, 宋健
Vahvistettu sähköpostiosoite verkkotunnuksessa sjtu.edu.cn
Nimike
Viittaukset
Viittaukset
Vuosi
Anisotropic thermal conductivity and associated heat transport mechanism in roll-to-roll graphene reinforced copper matrix composites
KM Yang, YC Ma, ZY Zhang, J Zhu, ZB Sun, JS Chen, HH Zhao, J Song, ...
Acta Materialia 197, 342-354, 2020
542020
Synergistically enhanced interface stability by graphene assisted copper surface reconstruction
KM Yang, Q Li, Q Zhang, GS Liu, JJ Wang, YF Yang, CX Guo, JM Ni, ...
Acta Materialia 226, 117638, 2022
272022
Synthesis, microstructure and properties of magnetron sputtered lead zirconate titanate (PZT) thin film coatings
Y Ma, J Song, X Wang, Y Liu, J Zhou
Coatings 11 (8), 944, 2021
262021
High performance Nb/TiNi nanocomposites produced by packaged accumulative roll bonding
D Jiang, J Song, H Yang, Y Liu, X Jiang, Y Ren, K Yu, L Cui
Composites Part B: Engineering 202, 108403, 2020
232020
Recent progress on interfacial structure optimization and their influencing mechanism of carbon reinforced metal matrix composites
T FAN, Y LIU, K YANG, J SONG, D ZHANG
Acta Metall Sin 55 (1), 16-32, 2018
172018
Enhanced heat transport capability across boron nitride/copper interface through inelastic phonon scattering
J Wang, Z Wang, K Yang, N Chen, J Ni, J Song, Q Li, F Sun, Y Liu, T Fan
Advanced Functional Materials 32 (40), 2206545, 2022
162022
Orientation independent heat transport characteristics of diamond/copper interface with ion beam bombardment
K Yang, Z Zhang, H Zhao, B Yang, B Zhong, N Chen, J Song, C Chen, ...
Acta Materialia 220, 117283, 2021
122021
High strength and low coercivity of cobalt with three-dimensional nanoscale stacking faults
Y Liu, J Song, G Liu, J Chen, C Wang, H Wang, J Wang, X Zhang
Nano Letters 21 (15), 6480-6486, 2021
122021
Transferring elastic strain in Mo/Nb/TiNi multilayer nanocomposites by the principle of lattice strain matching
D Jiang, J Song, H Yang, Y Liu, X Jiang, Y Ren, K Yu, L Cui
Composites Part B: Engineering 215, 108784, 2021
122021
A crystal plasticity model for metal matrix composites considering thermal mismatch stress induced dislocations and twins
YN Hou, KM Yang, J Song, H Wang, Y Liu, TX Fan
Scientific Reports 11 (1), 16053, 2021
112021
Graphene layer number-dependent heat transport across nickel/graphene/nickel interfaces
J Zhou, K Yang, B Yang, B Zhong, S Yao, Y Ma, J Song, T Fan, D Tang, ...
ACS Applied Materials & Interfaces 14 (30), 35237-35245, 2022
52022
Ferroelectric and ferroelastic domain related formation and influential mechanisms of vapor deposited piezoelectric thin films
C Chen, J Song, Q Zhang, M Gong, Y Liu, T Fan
Coatings 11 (12), 1437, 2021
52021
Reorientation Mechanisms of Graphene Coated Copper {001} Surfaces
J Song, S Yao, Q Li, J Ni, Z Yan, K Yang, G Liu, Y Liu, J Wang
Metals 13 (5), 910, 2023
42023
Formation of misfit dislocation arrays and helium nanochannels near copper surface assisted by high-temperature graphene deposition
KM Yang, GS Liu, HY Ma, J Song, Q Li, NQ Chen, YQ Wang, D Chen, ...
Acta Materialia 237, 118134, 2022
42022
In-situ TEM characterization of basal dislocations between nano-spaced long-period stacking ordered phases in MgYZn alloy
Q Li, J Song, Y Chen, Q Zhang, Q Zhu, Y Liu, J Wang, X Zeng
Scripta Materialia 235, 115601, 2023
32023
Characterization of the terrace-defect interfaces using in situ straining techniques
J Song, J Wang, Y Liu
Journal of Materials Research 36, 2674-2686, 2021
22021
Thickness-dependent strain rate sensitivity of nanolayers via the nanoindentation technique
J Song, Y Liu, Z Fan, X Zhang
Crystals 8 (3), 128, 2018
22018
Achieving atomically flat copper surface: Formation of mono-atomic steps and associated strain energy mechanisms
J Song, Q Zhang, S Yao, K Yang, H Ma, J Ni, B Zhong, Y Liu, J Wang, ...
Acta Materialia 263, 119414, 2024
12024
Significant strengthening of copper-based composites using boron nitride nanotubes
N Chen, Q Li, Y Ma, K Yang, J Song, Y Liu, T Fan
International Journal of Minerals, Metallurgy and Materials 30 (9), 1764-1778, 2023
12023
Quantifying Interfacial Bonding Using Thermal Boundary Conductance at Cubic Boron Nitride/Copper Interfaces with a Large Mismatch of Phonon Density of States
N Chen, K Yang, Z Wang, B Zhong, J Wang, J Song, Q Li, J Ni, F Sun, ...
ACS Applied Materials & Interfaces 15 (28), 34132-34144, 2023
12023
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Artikkelit 1–20