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Co-authors
- Thorsten WildNokia, Bell LabsVerified email at nokia-bell-labs.com
- Slawomir StanczakTechnische Universität Berlin and Fraunhofer HHIVerified email at tu-berlin.de
- Silvio MandelliSenior Researcher and Distinguished Member of Technical Staff, Nokia Bell LabsVerified email at nokia-bell-labs.com
- Paolo BaraccaSenior Staff Research Specialist, NokiaVerified email at nokia.com
- Hafiz ImtiazGraduate Student, Rutgers UniversityVerified email at rutgers.edu
- Anand SarwateAssociate Professor, Rutgers UniversityVerified email at rutgers.edu
- Ali ZaidiEricsson, SwedenVerified email at ericsson.com
- Alessandro BrighenteAssistant Professor (RTDa), University of PadovaVerified email at unipd.it
- Richard J. WeilerDeutsche TelekomVerified email at hhi.fraunhofer.de
- Yue RongProfessor at Curtin UniversityVerified email at curtin.edu.au
- Feifei GaoAssociate Professor at Tsinghua University, IEEEFellowVerified email at ieee.org
- Steffen LimmerSiemens AGVerified email at siemens.com
- Bradley BakerGeorgia Institute of TechnologyVerified email at gsu.edu
- Rogers F SilvaTReNDS Center (Translational Research in Neuroimaging and Data Science); GSU/GATech/EmoryVerified email at gsu.edu
- Sergey PlisTReNDS center: GSU, Emory, and GATechVerified email at gsu.edu
- Jan SchreckIntel CooperationVerified email at intel.com
- Federico PennaSamsung Semiconductor, Inc.Verified email at samsung.com
- Jalal EtesamiTechnical University of MunichVerified email at tum.de
- Wen Chen, CIE Fellow, IEEE DLShanghai Jiao Tong University, Editor, IEEE TWC/TCOM/ACCESS/OJVTVerified email at sjtu.edu.cn
- Wei ChenState Key Lab of CAD&CG, Zhejiang universityVerified email at cad.zju.edu.cn